Master Bond EP21LV Low Viscosity Two Component Epoxy

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Master Bond Inc.
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Master Bond EP21LV Low Viscosity Two Component Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Master Bond Polymer System EP21LV is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a very forgiving one to one mix ratio by weight or volume. In fact, EP21LV has the unusual characteristic of being able to adjust the properties of the cured system by altering the mix ratio. Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.

Physical Properties	Metric	English	Comments
Viscosity	6000 - 8000 cP @Temperature 23.0 °C	6000 - 8000 cP @Temperature 73.4 °F

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	121 °C	250 °F
Minimum Service Temperature, Air	-51.1 °C	-60.0 °F

Processing Properties	Metric	English	Comments
Cure Time	60.0 - 120 min @Temperature 93.3 °C	1.00 - 2.00 hour @Temperature 200 °F
	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F

Descriptive Properties	Value	Comments
Color Code	"A" Clear; "B" Amber
Mix Ratio By Weight	100/100
Set-Up Time, minutes	60-90	At Room Temperature

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