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Master Bond EP21LV Low Viscosity Two Component Epoxy

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP21LV Low Viscosity Two Component Epoxy.pdf
Price EMAIL US    sales@lookpolymers.com
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Material Notes:
Master Bond Polymer System EP21LV is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a very forgiving one to one mix ratio by weight or volume. In fact, EP21LV has the unusual characteristic of being able to adjust the properties of the cured system by altering the mix ratio. Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.
Physical Properties Metric English Comments
Viscosity 6000 - 8000 cP

@Temperature 23.0 °C
6000 - 8000 cP

@Temperature 73.4 °F
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Processing Properties Metric English Comments
Cure Time 60.0 - 120 min

@Temperature 93.3 °C
1.00 - 2.00 hour

@Temperature 200 °F
1440 - 2880 min

@Temperature 23.0 °C
24.0 - 48.0 hour

@Temperature 73.4 °F
Descriptive Properties Value Comments
Color Code "A" Clear; "B" Amber
Mix Ratio By Weight 100/100
Set-Up Time, minutes 60-90
At Room Temperature
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