Master Bond EP21 Room Temperature Curing Epoxy System

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Master Bond Inc.
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Master Bond EP21 Room Temperature Curing Epoxy System.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Room temperature curing epoxy adhesive Master Bond EP21 has outstanding physical properties and durability. Its variable mix ratio feature allows you to adjust the type of cure to get either a more rigid cure for enhanced machineability, or a more forgiving cure for greater impact resistance. EP21 conforms to Title 21, US Code of Federal Regulations, FDA Chapter 1 Section 175.105.

Physical Properties	Metric	English	Comments
Viscosity	50000 - 60000 cP @Temperature 23.0 °C	50000 - 60000 cP @Temperature 73.4 °F

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	121 °C	250 °F
Minimum Service Temperature, Air	-51.1 °C	-60.0 °F

Processing Properties	Metric	English	Comments
Cure Time	120 min @Temperature 93.3 °C	2.00 hour @Temperature 200 °F
	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F

Descriptive Properties	Value	Comments
Color Code	"A" Gray; "B" Tan
Mix Ratio By Weight	100/100
Set-Up Time, minutes	60-90	At Room Temperature

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