Processing Properties | Metric | English | Comments |
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Cure Time | 45.0 min @Temperature 100 °C |
0.750 hour @Temperature 212 °F |
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Parker Chomerics CHO-BOND 360-208 Conductive Epoxy Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting E.. |
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Cure Time | 45.0 min @Temperature 100 °C |
0.750 hour @Temperature 212 °F |
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Parker Chomerics CHO-BOND 360-20 Conductive Epoxy Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting E.. |
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Cure Time | 45.0 min @Temperature 149 °C |
0.750 hour @Temperature 300 °F |
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Master Bond EP19HT One Component, Storage Stable Epoxy System Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features excellent storage c.. |
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Cure Time | 45.0 min @Temperature 149 °C |
0.750 hour @Temperature 300 °F |
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Master Bond Supreme 10HTS Silver Filled Electrically Conductive One Part Epoxy Master Bond Supreme 10HT/S is a one component, no mix high purity silver conductive system formulated to cure at elevated temperatures. Tensile shear strengths greater than 1,200 psi and T-peel stre.. |
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Cure Time | 45.0 min @Temperature 120 °C |
0.750 hour @Temperature 248 °F |
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Tra-Con Tra-Bond 293-1 General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293-se.. |
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Cure Time | 45.0 min @Temperature 120 °C |
0.750 hour @Temperature 248 °F |
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Tra-Con Tra-Bond 293-1.5T General Purpose Instrument Epoxy Adhesive-Flexible TRA-BOND 293-1.5T general purpose epoxy adhesive is designed to provide strong, semi-rigid bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. This v.. |
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Cure Time | 45.0 min @Temperature 120 °C |
0.750 hour @Temperature 248 °F |
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Tra-Con Tra-Bond 293-1M General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1M general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper and brass. The 293-se.. |
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Cure Time | 45.0 min @Temperature 100 °C |
0.750 hour @Temperature 212 °F |
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Trelleborg Emerson & Cuming Eccobond® D 778 One-Component Fast Cure Epoxy Adhesive Emerson & Cuming D 778 Eccobond® One-Component Fast Cure Epoxy AdhesiveHigh strength, semi-flexible, thixotropic, fast heat curing, epoxy structural adhesive. Good peel strength (20 pli). Recommend.. |
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Cure Time | 45.0 min @Temperature 120 °C |
0.750 hour @Temperature 248 °F |
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Tra-Con Tra-Bond 293-1T General Purpose Instrument Epoxy Adhesive-Thixotropic TRA-BOND 293-1T general purpose epoxy adhesive is designed to provide strong, semi-rigid bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. This ver.. |
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Cure Time | 45.0 min @Temperature 25.0 °C |
0.750 hour @Temperature 77.0 °F |
Full Load |
Chesterton ARC 5 Paste grade Rapid Cure Abrasion Control Description: ARC 5 is an advanced composite formulated for emergency repair and patching of metal components subject to light abrasive and corrosive conditions. It can be used to seal leaks and patc.. |
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Cure Time | 45.0 min @Temperature 80.0 °C |
0.750 hour @Temperature 176 °F |
Minimum Bond Line |
Epoxy Technology EPO-TEK® H20-FC Electrically Conductive Epoxy Product Description: EPO-TEK®H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly.Adv.. |
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Cure Time | 45.0 min @Temperature 100 °C |
0.750 hour @Temperature 212 °F |
Minimum Bond Line |
Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two .. |
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Cure Time | 45.0 min @Temperature 80.0 °C |
0.750 hour @Temperature 176 °F |
Minimum Bond Line |
Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A.. |
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Cure Time | 45.0 min @Temperature 80.0 °C |
0.750 hour @Temperature 176 °F |
minimum |
Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology |
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Cure Time | 45.0 min @Temperature 32.0 °C |
0.750 hour @Temperature 89.6 °F |
Full Load |
Chesterton ARC MX5 Rapid Curing Fine Particle Wear Compound Description: An advanced ceramic reinforced composite for the emergency repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a th.. |
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Cure Time | 45.0 min @Temperature 175 °C |
0.750 hour @Temperature 347 °F |
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Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also .. |
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Cure Time | 45.0 - 60.0 min @Temperature 100 °C |
0.750 - 1.00 hour @Temperature 212 °F |
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ACC QGel 315 QSI Quantum Silicones General Purpose Silicone Gel QGel 315 is a clear, very soft, tough moderately cross-linked silicone polymer. Silicone gels are used to provide protection from vibration and thermal or mechanical shock. Silicone gels also provid.. |
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Cure Time | 45.0 min @Temperature 50.0 °C |
0.750 hour @Temperature 122 °F |
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Atom Adhesives AA-DUCT 902 Epoxy Adhesive and Coating AA-DUCT 902 is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of.. |
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Cure Time | 45.0 min @Temperature 75.0 °C |
0.750 hour @Temperature 167 °F |
Dry to handle, at 50% humidity and 75°C |
Blue River Coatings High Performance Acrylic Sanding Sealer BLUE RIVER COATINGS HIGH PERFORMANCE ACRYLIC SANDING SEALER is a waterbased wood sealer to fill the grain. The product is designed to be a sandable self-sealing topcoat for wood. HIGH PERFORMANCE AC.. |
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Cure Time | 45.0 min @Temperature 75.0 °C |
0.750 hour @Temperature 167 °F |
Dry to handle, at 50% humidity and 75°C |
Blue River Coatings High Performance Acrylic Topcoat BLUE RIVER COATINGS HIGH PERFORMANCE ACRYLIC TOPCOAT is a water dispersible acrylic enamel. HIGH PERFORMANCE ACRYLIC TOPCOAT is designed to be a low VOC and EPA compliant coating with excellent cove.. |
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Cure Time | 45.0 min @Temperature 75.0 °C |
0.750 hour @Temperature 167 °F |
Dry to handle, at 50% humidity and 75°C |
Blue River Coatings Hyfro-Flex Polyurethane Top Coat BLUE RIVER COATINGS HYDRO-FLEX POLYURETHANE TOPCOAT is a water dispersible polyurethane. When the customer receives HYDRO-FLEX, it is already formed in the container, where as the solvent base type,.. |
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Cure Time | 45.0 min @Temperature 149 °C |
0.750 hour @Temperature 300 °F |
alternate cure |
Aremco Aremco-Bond™ 2330 High Performance Epoxide Single-Part, Heat Curable, Silicone Elastomer Adhesive |
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Cure Time | 45.0 min @Temperature 249 °C |
0.750 hour @Temperature 480 °F |
>1 Hour Air Set Required Prior to Curing |
Aremco Corr-Paint™ CP4010 High Temperature Protective Silicone Coating, Aluminum Filled Single part, silicone-based, low viscosity, heat-curable, aluminum-filled sealer offering exceptional moisture resistance to 1100°F (593°C). |
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Cure Time | 45.0 min @Temperature 23.0 °C |
0.750 hour @Temperature 73.4 °F |
M10 steel, handling strength |
Permabond A131 Anaerobic Threadsealant Permabond® A131 is an anaerobic adhesive designed to seal threaded metal pipe connections carrying a wide variety of gases and liquids, including potable water. Suitable for use on both parallel an.. |