| Category | Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive |
| Manufacturer | Aremco |
| Trade Name | Aremco-Bond™ |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Aremco Aremco-Bond™ 2330 High Performance Epoxide.pdf |
| Price | EMAIL US sales@lookpolymers.com |
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 1.43 g/cc | 1.43 g/cc | |
| Viscosity | 38000 cP | 38000 cP | mixed viscosity |
| Linear Mold Shrinkage | 0.0030 cm/cm | 0.0030 in/in |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore A | 43 | 43 | |
| Shear Strength | 2.93 MPa | 425 psi | ASTM D1002-94 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 169 µm/m-°C | 94.0 µin/in-°F | |
| Maximum Service Temperature, Air | 300 °C | 572 °F | |
| Minimum Service Temperature, Air | -60.0 °C | -76.0 °F |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 2.00e+15 ohm-cm | 2.00e+15 ohm-cm | |
| Dielectric Constant | 3.3 @Frequency 1000 Hz |
3.3 @Frequency 1000 Hz |
|
| Dielectric Strength | 21.7 kV/mm | 550 kV/in | |
| Dissipation Factor | 0.020 | 0.020 |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 204 °C |
0.500 hour @Temperature 400 °F |
alternate cure |
| 45.0 min @Temperature 149 °C |
0.750 hour @Temperature 300 °F |
alternate cure | |
| 60.0 min @Temperature 93.3 °C |
1.00 hour @Temperature 200 °F |
recommended cure |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Chemical Resistance | Good | |
| Color | Red |