Polymer Property : Thermal Conductivity = 2.08 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F	ASTM C518
Rogers Corporation XT/duroid™ 8100 0.004" Woven Glass Reinforced Thermoplastic Circuit Material XT/duroid™ 8100 woven glass reinforced thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. XT/duroid 81..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F
Premix Premi-Glas® 1100V-20 Fiberglass Reinforced Thermoset BMC Premi-Glas® 1100V-20 is a fiberglass reinforced thermoset bulk molding compound for electrical and flame retardant applications.Key features and benefits are:Non-Halogen FR technology for regulator..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F
Premix Premi-Glas® 1200H-15 Polyester SMC Premi-Glas® 1200H-15 is a 15% fiberglass-reinforced, thermoset, Sheet Molding Compound designed for applications where good arc resistance and dielectric strength are required and UL 94 HB flame re..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F
Premix Premi-Glas® 2143-24 CR-SX-HT Fiberglass Reinforced Thick Molding Compound Premi-Glas® 2143-24 CR-SX is a fiberglass reinforced thermoset thick molding compound for electrical and flame retardant applications.Key features and benefits are:TMC compounding process preserves..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F
Premix Premi-Glas® 2203-25 CR-SX-HT Fiberglass Reinforced Thermoset SMC Premi-Glas® 2203-25 CR-SX-HT is a fiberglass reinforced thermoset sheet molding compound for electrical and flame retardant applications.Key features and benefits are:Enhanced product for higher UL..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F
Premix Premi-Glas® 2205-25 CR-SX Fiberglass Reinforced SMC Description: Premi-Glas® 2205-25 CR-SX is a fiberglass reinforced thermoset Sheet Molding Compound formulated for excellent electrical properties and fire retardance; it also has very good thermal ..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F
Quadrant EPP Ertalon® 4.6 PA 4.6, extruded (ISO Data) Compared with conventional nylons, Ertalon 4.6 features a better retention of stiffness and creep resistance over a wide range of temperatures as well as superior heat ageing resistance. Therefore, ..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F	ASTM D177
Petroquimica Triunfo Trithene® JX 7065 LDPE - Injection Molding and Master Batch The Trithene® JX 7065 resin is a low-density polyethylene with a wide molecular weight distribution, developed to offer good impact resistance, excellent flexibility, and high resistance to stress ..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F
Premix Premi-Glas® 1281-47 VE SMC Description: Premi-Glas® 1281-47 VE is a sheet molding compound.Market: StructuralInformation provided by Premix.
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F
Premix Premi-Glas® 2103-10 CRSX Polyester BMC Premi-Glas® 2103-10 CR-SX is a 10% glass reinforced thermoset Sheet Molding Compound designed for electrical switchgear and industrial circuit breaker applications. Key features and benefits are:U..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F	Average; ISO 22007-4
Victrex® PEEK 150GL15 Polyetheretherketone, 15% Glass Fibre Reinforced Product Description:High performance thermoplastic material, 15% glass fibre reinforced Polyetheretherketone (PEEK), semi crystalline, granules for injection moulding, very easy flow, FDA food conta..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F	Average; ISO 22007-4
Victrex® PEEK 450GL30 30% Glass Fiber Reinforced Product Description: High performance thermoplastic material, 30% glass fibre reinforced PolyEtherEtherKetone (PEEK), semi crystalline, granules for injection molding and extrusion, standard flow, F..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F	Average; ISO 22007-4
Victrex® PEEK 90GL30 BLACK EU 30% Glass Fiber Filled, PolyEtherEtherKetone High performance thermoplastic material, 30% glass fiber reinforced PolyEtherEtherKetone (PEEK), semi crystalline, granules for injection molding, very easy flow, FDA and EU food contact compliant, ..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 3-7088-1 Polyamide 6, with carbon fiber and glass fiber, low-warpage Applications: Automotive industry, textile machinery, apparatus- and precision engineering.Strong, stiff parts.dynamic stressElectrically conductive, suitable for continuous discharging of staticall..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ftÂ²-Â°F	ASTM C177
Solvay Specialty Polymers RytonÂ® QC160P Polyphenylene Sulfide (PPS) RytonÂ® QC160P (pelletized) polyphenylene sulfide exhibits excellent thermal stability and chemical resistance and is suitable for thermoplastic extrusion processes.Features: Good Chemical Resista..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ftÂ²-Â°F
Shin-Etsu Silicones KE-1204 B Silicone, Potting/Encapsulation RTV Information Provided by Shin-Etsu Silicones of America, Inc.
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ftÂ²-Â°F	ASTM E 1530
SABIC Innovative Plastics LNP Thermotuf VF002 PA 66 LNP THERMOTUF* VF002 is a compound based on Nylon resin containing Glass Fiber. Added features of this material include: High Impact.This data was supplied by SABIC-IP for the Americas region.
Thermal Conductivity	0.300 W/m-K @Temperature 121 °C	2.08 BTU-in/hr-ft²-°F @Temperature 250 °F
Tra-Con Tra-Bond 789-3 Moisture Resistant Adhesive TRA-BOND 789-3 one component, high strength toughened adhesive is designed for microelectronic applications, including substrate attach and package sealing, which require good moisture resistance. I..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F
Ensinger TECATRON™ PPS Polyphenylene sulfide (PPS) TECATRON PPS is a high performance thermoplastic that combines good mechanical properties with excellent thermal and chemical resistance properties. There is no known solvent that dissolves TECATRON..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F	ISO 8302
Eurostar Starflam PF0057E PA6, 25% Glass Filled, Injection Molded Halogen Free and Red Phosphorous Free, Flame Retardant, Glass Fiber Reinforced, Polyamide 6 Injection Molding Resin (also known as PF-1005 Z270)Information provided by Polymer Technology & Services,..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F	ASTM E1461
Arlon 37N Polyimide Low-Flow 37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is requir..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F	ASTM E1461
Arlon 38N High Performance Polyimide Low-Flow 38N is an improved polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F	ASTM E1530
3M Scotchcast™ 5230N Electrical Epoxy Powder Resin 3M Scotchcast Electrical Resin 5230N is a widely used, general purpose epoxy powder resin. A one-part, blue pigmented, rapid heat-curing product, it is designed to provide a continuous, tough moistu..
Thermal Conductivity	0.300 W/m-K @Temperature 23.0 °C	2.08 BTU-in/hr-ft²-°F @Temperature 73.4 °F
Touchstone CFOAM® 30 Structural Carbon Foam CFOAM, developed by Touchstone Research Laboratory, Ltd., is a next generation structural material which is inexpensive, lightweight, fire-resistant, impact-absorbing, and which can be thermally ins..
Thermal Conductivity	0.300 W/m-K	2.08 BTU-in/hr-ft²-°F	DIN 52612
Lehmann & Voss LUVOCOM® 50/GF/20/TF/10/BK Polycarbonate, with glass fiber and PTFE Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi..