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Tra-Con Tra-Bond 789-3 Moisture Resistant Adhesive

Category Polymer , Adhesive , Thermoset
Manufacturer Tra-Con, Inc.
Trade Name Tra-Bond
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Bond 789-3 Moisture Resistant Adhesive.pdf
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Material Notes:
TRA-BOND 789-3 one component, high strength toughened adhesive is designed for microelectronic applications, including substrate attach and package sealing, which require good moisture resistance. It exhibits strong adhesion to difficult-to-bond metals, such as gold, silver and copper. This adhesive retains its bond strength after exposure to moisture. TRA-BOND 789-3 is available in a variety of colors to fit the application.Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Viscosity 36500 cP
36500 cP
Mixed
Mechanical Properties Metric English Comments
Adhesive Bond Strength 37.9 MPa
5500 psi
Lap shear, gold to gold
Thermal Properties Metric English Comments
CTE, linear 63.0 µm/m-°C
35.0 µin/in-°F
Below Tg
140 µm/m-°C
77.8 µin/in-°F
Above Tg
Thermal Conductivity 0.300 W/m-K

@Temperature 121 °C
2.08 BTU-in/hr-ft²-°F

@Temperature 250 °F
Maximum Service Temperature, Air 150 °C
302 °F
Minimum Service Temperature, Air -60.0 °C
-76.0 °F
Glass Transition Temp, Tg 126 °C
259 °F
Ultimate Tg
Electrical Properties Metric English Comments
Volume Resistivity 2.00e+14 ohm-cm
2.00e+14 ohm-cm
Dielectric Constant 4.2

@Frequency 1000 Hz
4.2

@Frequency 1000 Hz
Dielectric Strength 31.5 kV/mm
800 kV/in
Dissipation Factor 0.011

@Frequency 1000 Hz
0.011

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
60.0 min

@Temperature 125 °C
1.00 hour

@Temperature 257 °F
Shelf Life 6.00 Month
6.00 Month
At 5°C
12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
Descriptive Properties Value Comments
Color Cream
Outgassing, NASA Passes
Weight Loss % 0.28
At 250°C
Working Life, months 3
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