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Arlon 38N High Performance Polyimide Low-Flow

Category Polymer , Thermoset , Polyimide, TS
Manufacturer Arlon
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Arlon 38N High Performance Polyimide Low-Flow.pdf
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Material Notes:
38N is an improved polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.Novel chemistry ensuring faster and more uniform resin cure for minimal and consistent resin flow, preventing excessive flow into clearance/relief areasTg = 200°C and expansion characteristics typical of polyimide greatly improves PTH reliabilityImproved bond strength to Kapton® polyimide of up to 50% compared with conventional polyimide low-flow or no-flow productsCurable at temperatures as low as 350°FExcellent thermal stabilityImproved bond strength to copper and other metals for excellent performance in heat sink bonding applicationsElectrical and mechanical properties meeting the requirements of IPC-4101/42Compatible with lead-free solder processingRoHS/WEEE compliantTypical Applications:Bonding multilayer polyimide rigid-flexAttaching heat sinks to polyimide MLBsOther applications where minimal and uniform resin flow is requiredThis data represents typical values for the production material and should not be used as material specifications.Information provided by ARLON Silicone Technologies Division.
Physical Properties Metric English Comments
Water Absorption <= 1.0 %
<= 1.0 %
IPC TM-650 2.6.2.1
Mechanical Properties Metric English Comments
Tensile Strength 221 MPa
32000 psi
IPC TM-650 2.4.18.3
Modulus of Elasticity 14.5 GPa
2100 ksi
IPC TM-650 2.4.18.3
Flexural Strength 414 MPa
60000 psi
IPC TM-650 2.4.4
Poissons Ratio 0.18
0.18
ASTM D3039
Shear Modulus 6.14 GPa
891 ksi
Calculated
Peel Strength 0.912 kN/m
5.20 pli
To Kapton, After Solder
1.03 kN/m
5.90 pli
To Kapton, As Received
1.49 kN/m
8.50 pli
To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
Thermal Properties Metric English Comments
CTE, linear 17.0 µm/m-°C
9.44 µin/in-°F
IPC TM-650 2.4.41
CTE, linear, Transverse to Flow 54.0 µm/m-°C
30.0 µin/in-°F
z, below Tg; IPC TM-650 2.4.24
157 µm/m-°C
87.2 µin/in-°F
z, above Tg; IPC TM-650 2.4.24
Thermal Conductivity 0.300 W/m-K
2.08 BTU-in/hr-ft²-°F
ASTM E1461
Glass Transition Temp, Tg 200 °C
392 °F
TMA; IPC TM-650 2.4.24
Decomposition Temperature 311 °C
592 °F
Onset; IPC TM-650 2.3.41
330 °C
626 °F
5 percent; IPC TM-650 2.3.41
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Volume Resistivity 8.20e+13 ohm-cm
8.20e+13 ohm-cm
C96/35/90; IPC TM-650 2.5.17.1
4.70e+15 ohm-cm
4.70e+15 ohm-cm
E24/125; IPC TM-650 2.5.17.1
Surface Resistance 4.40e+12 ohm
4.40e+12 ohm
C96/35/90; IPC TM-650 2.5.17.1
1.20e+15 ohm
1.20e+15 ohm
E24/125; IPC TM-650 2.5.17.1
Dielectric Constant 4.25

@Frequency 1.00e+6 Hz
4.25

@Frequency 1.00e+6 Hz
may vary with resin %; IPC TM-650 2.5.5.3
Dielectric Strength 63.0 kV/mm
1600 kV/in
IPC TM-650 2.5.6.2
Dissipation Factor 0.010

@Frequency 1.00e+6 Hz
0.010

@Frequency 1.00e+6 Hz
IPC TM-650 2.5.5.3
Arc Resistance 125 sec
125 sec
IPC TM-650 2.5.1
Descriptive Properties Value Comments
IPC Delamination - T260 (minutes) 50
IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes) 5
IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes) 3
IPC TM-650 2.4.24.1
Z-Axis Expansion (%) 1.5
IPC TM-650 2.4.24 (50-260°C)
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