Arlon 38N High Performance Polyimide Low-Flow

38N is an improved polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.Novel chemistry ensuring faster and more uniform resin cure for minimal and consistent resin flow, preventing excessive flow into clearance/relief areasTg = 200°C and expansion characteristics typical of polyimide greatly improves PTH reliabilityImproved bond strength to Kapton® polyimide of up to 50% compared with conventional polyimide low-flow or no-flow productsCurable at temperatures as low as 350°FExcellent thermal stabilityImproved bond strength to copper and other metals for excellent performance in heat sink bonding applicationsElectrical and mechanical properties meeting the requirements of IPC-4101/42Compatible with lead-free solder processingRoHS/WEEE compliantTypical Applications:Bonding multilayer polyimide rigid-flexAttaching heat sinks to polyimide MLBsOther applications where minimal and uniform resin flow is requiredThis data represents typical values for the production material and should not be used as material specifications.Information provided by ARLON Silicone Technologies Division.