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Polymer Property : CTE, linear = 17.2 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 31.0 µm/m-°C @Temperature 20.0 °C |
17.2 µin/in-°F @Temperature 68.0 °F |
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| RedEye On Demand Polyphenylsulfone (PPSF), Rapid Prototyping Material Polyphenylsulfone (PPSF) is a durable high-end thermoplastic that can be used in the toughest applications. Parts built in PPSF can handle heat near 400°F (204°C), it resists petroleum products, a.. |
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| CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1100-8194 Polyether sulfone, with glass fiber Applications: Apparatus- and precision engineering, film- and photo industry, sporting- and leisure goods, medical- and electrical enineering, aircraft- and aerospace industry.High dimensionally sta.. |
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| CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1100/GF/20/EM/MR Polyether sulfone, with glass fiber, easy flowing, demolding aid Applications: Apparatus- and precision engineering, film- and photo industry, sporting- and leisure goods, medical- and electrical enineering, aircraft- and aerospace industry.High dimensionally sta.. |
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| CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1100/GF/20/EM/MR/BK Polyether sulfone, with glass fiber, easy flowing, demolding aid Applications: Apparatus- and precision engineering, film- and photo industry, sporting- and leisure goods, medical- and electrical enineering, aircraft- and aerospace industry.High dimensionally sta.. |
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| CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1100-8049 Polyether sulfone, with glass fiber Applications: Apparatus- and precision engineering, film- and photo industry, sporting- and leisure goods, medical- and electrical enineering, aircraft- and aerospace industry.High dimensionally sta.. |
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| CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | ASTM D696 |
| Samyang Trirex® SF3200GNH20 Polycarbonate, Reinforced Non Halogen for Printers PC is characterized by its excellent impact resistance, dimensional stability and excellent thermal resistance.SF3200GNH20 is a reinforced, non-halogen grade for Printers.Applications: Office Machi.. |
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| CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | ISO 11359-2 |
| Unitika A1030GFL PA6, 30% Glass Fiber Reinforced, Conditioned Information provided by Unitika Ltd. |
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| CTE, linear | 31.0 µm/m-°C @Temperature 20.0 °C |
17.2 µin/in-°F @Temperature 68.0 °F |
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| Williams Advanced Alloys WS145 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | Below Tg |
| Tra-Con Tra-Duct 925M01 Low Ion Snap Cure Silver-Filled Epoxy TRA-DUCT 925M01 is a low ion snap cure silver-filled epoxy. TRA-DUCT 925M01 develops strong, durable, void free electrically and thermally conducting bonds. The product can be screen printed, stenci.. |
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| CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® 323LP Epoxy Material Description: Longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications.Information Provided by Epoxy Technology |
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| CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al.. |
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| CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two .. |
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| CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec.. |
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| CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | |
| Hippe PAI Polyamide-imide Particularly used where high strength in a wide range of temperature (-190°C…+260°C), high notched strength and very good dielectric properties are required. Features good chemical stability, fl.. |
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| CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm.. |
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| CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also .. |
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| CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | x direction |
| Arlon IsoClad 933 Non-Woven Fiberglass Reinforced PTFE Traditional - Highest Performance, PTFE Coated Light Woven Glass Styles, Interdispersed PTFE FilmInformation provided by Arlon Materials for Electronics (MED). |
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| CTE, linear | 31.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
17.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
| BASF Ultramid® 8234G HS 44% Glass Filled PA6 (Dry) Ultramid 8234G HS is a heat stabilized, 44% glass fiber reinforced polyamide 6 injection molding compound offering the highest level of strength, stiffness, high temperature performance and dimensio.. |
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| CTE, linear | 31.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
17.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
| BASF Ultramid® 8266G HS BK-102 15/25% Glass/Mineral Filled PA6 (Dry) Ultramid 8266G HS is a heat stabilized, 40% glass and mineral reinforced nylon 6 injection molding compound resulting in a balance of engineering properties with excellent dimensional stability, low.. |
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| CTE, linear | 31.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
17.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
| BASF Ultramid® 8267G HS BK-106 15/25% Glass/Mineral Filled PA6 (Dry) Ultramid 8267G HS BK-106 is a heat stabilized, weather resistant, 40% mineral and glass fiber reinforced PA6 injection molding compound with improved UV resistance and sink mark resistance. The com.. |
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| CTE, linear | 31.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
17.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
| BASF Ultramid® 8267G HS BK-106A 15/25% Glass/Mineral Filled PA6 (Dry) Ultramid 8267G HS BK-106A is a heat stabilized, weather resistant, 40% mineral and glass fiber reinforced PA6 injection molding compound with improved UV resistance and sink mark resistance. The co.. |
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| CTE, linear | 31.0 µm/m-°C @Temperature 20.0 °C |
17.2 µin/in-°F @Temperature 68.0 °F |
TMA; ASTM E831 |
| LNP Thermocomp® FP-VC-1003 BK8-019 Polyvinylidene Fluoride, Carbon Fiber Reinforcement
(discontinued **) Forms: PelletsProcessing Method: Injection MoldingInformation provided by LNP, a GE Plastics Company.This data sheet is labeled Discontinued; however many LNP grades are still active under new names.. |
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| CTE, linear | 31.0 µm/m-°C @Temperature 20.0 °C |
17.2 µin/in-°F @Temperature 68.0 °F |
TMA; ASTM E831 |
| LNP Thermocomp® QF-1006 Polyamide 6/10 Copolymer, Glass Fiber Reinforcement
(discontinued **) Forms: PelletsProcessing Method: Injection MoldingInformation provided by LNP, a GE Plastics Company.This data sheet is labeled Discontinued; however many LNP grades are still active under new names.. |
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| CTE, linear | 31.0 µm/m-°C | 17.2 µin/in-°F | ASTM D696 |
| Solvay Specialty Polymers Torlon® 4203 Polyamide-imide (PAI)
(discontinued **) Torlon 4203 is an unreinforced, lubricated, pigmented grade of polyamide-imide (PAI) resin for extrusion. It has the best impact resistance and greatest elongation of all the Torlon grades. Torlon P.. |
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| CTE, linear | 31.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
17.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
| BASF Nypel® 2367G HS BK 15/25% Glass/Mineral Filled PA6 (Dry) Nypel 2367G HS BK-4 is a black pigmented, heat stabilized, 40% mineral and glass fiber reinforced injection molding compound based on recycled PA6 feedstocks. It possesses a balance of engineering .. |
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| CTE, linear | 31.0 - 50.4 µm/m-°C | 17.2 - 28.0 µin/in-°F | Average value: 37.4 µm/m-°C Grade Count:9 |
| Overview of materials for Polyethersulfone (PES), 10% Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Polyethersulfone (PES), 10% Glass Fiber Filled". Specific grades with glass content between 5% and 14% a.. |
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| CTE, linear | 31.0 - 120 µm/m-°C | 17.2 - 66.7 µin/in-°F | Average value: 69.8 µm/m-°C Grade Count:10 |
| Overview of materials for Polypropylene, Flame Retardant This property data is a summary of similar materials in the MatWeb database for the category "Polypropylene, Flame Retardant". Each property range of values reported is minimum and maximum values of.. |
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