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Polymer Property : Glass Transition Temp, Tg = 104 °F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Glass Transition Temp, Tg 40.0 °C
104 °F
Permabond ET515 Epoxy Resin
PERMABOND® ET515 is a 1:1 mixable epoxy adhesive. ET515 is a semi-flexible toughened adhesive with good adhesion to a variety of substrates such as wood, metal, ceramics and some plastics and compo..
Glass Transition Temp, Tg 40.0 °C
104 °F
Humiseal 2A64 Urethane Conformal Coating
Humiseal 2A64 Urethane Conformal CoatingHigh moisture resistanceExcellent dielectrical propertiesExcellent chemical resistanceRepairableMIL-I-46058C ApprovedPasses thermal shock test (MIL-I-46058C)F..
Glass Transition Temp, Tg 40.0 °C
104 °F
Mallard Creek Polymers ROVENE® 4201 SBR Emulsion
ROVENE® 4201 is a carboxylated styrene-butadiene emulsion that has a stiff or "boardy" hand. This binder is recommended for use as a crosslink-able binder for durable nonwovens such as floor main..
Glass Transition Temp, Tg 40.0 °C
104 °F
Lucite International Elvacite ® 4059 Acrylic Resin
Elvacite® 4059 is a solid acrylic bead resin which has been specially developed for use as a performance enhancing additive in a range of radiation (UV and EB) curable inks and coatings. These en..
Glass Transition Temp, Tg 40.0 °C
104 °F
DSC
Solvay Specialty Polymers Kalix® 5950 HFFR Polyamide, High Performance (HPPA), 50% Glass Fiber
Kalix® 5950 HFFR is a halogen-free, flame retardant (UL-94 V0 at 0.4 mm), highly reinforced polyamide material specifically formulated for high strength and stiffness applications where good impa..
Glass Transition Temp, Tg 40.0 °C
104 °F
Unitika elitel UE3240 Polyester, Pellet
Medium Tg high elongation, Binder paint, Adhesive agentUNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as adh..
Glass Transition Temp, Tg 40.0 °C
104 °F
Unitika elitel UE3250 Polyester, Pellet
High elongation type UE3240, Binder paint, Adhesive agentUNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as a..
Glass Transition Temp, Tg 40.0 - 80.0 °C
104 - 176 °F
Zeus ETFE Tubing
ETFE (Ethylenetetrafluoroethylene), a copolymer of ethylene and tetrafluoroethylene, is used in applications requiring excellent impact, abrasion and stress cracking resistance. This polymer possess..
Glass Transition Temp, Tg 40.0 °C
104 °F
Ultimate Tg
Tra-Con Tra-Bond F125 Fast Gel Clear Epoxy Adhesive
TRA-BOND F125 is a 10 minute gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. This clear, two part system is easily mixed and used at room te..
Glass Transition Temp, Tg 40.0 °C
104 °F
Ultimate Tg
Tra-Con Tra-Bond FS469 Clear High Strength Epoxy
TRA-BOND FS469 is a clear low viscosity epoxy formulation designed for bonding and coating micro-electronics, laminations, optical components and laser assemblies. The low cure shrinkage (using a ro..
Glass Transition Temp, Tg 40.0 °C
104 °F
Ultimate Tg
Tra-Con Tra-Coat WCC2A Clear Dual-Cure Semi-Flexible Adhesive
WCC2A is a clear, non-yellowing, dual-cure (UV and Heat) nameplate coating that is ideal for applications that require a glossy, "lens-like" finish. This photopolymer will also offer low shrinkage d..
Glass Transition Temp, Tg 40.0 °C
104 °F
Unitika elitel UE3216 Polyester, Pellet
Low Tg type UE3215UNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as adhesives, paints, ink binders, and modi..
Glass Transition Temp, Tg 40.0 - 48.0 °C
104 - 118 °F
UV Postcure; ASTM E1545-05A
DSM Somos® NeXt LV Grey
The second member of the Somos® NeXt family, Somos® NeXt LV Grey delivers the durability and functionality, with a finer resolution of details and faster part processing. This third-generation, hi..
Glass Transition Temp, Tg >= 40.0 °C
>= 104 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy
Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic indust..
Glass Transition Temp, Tg >= 40.0 °C
>= 104 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other..
Glass Transition Temp, Tg >= 40.0 °C
>= 104 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy
Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr..
Glass Transition Temp, Tg >= 40.0 °C
>= 104 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® EJ2189-LV Electrically Conductive Epoxy
Low Viscosity, two component room temp curing conductive epoxyInformation Provided by Epoxy Technology
Glass Transition Temp, Tg >= 40.0 °C
>= 104 °F
Epoxy Technology EPO-TEK® EV2118-2 Silver-filled, electrically conductive epoxy
Preliminary Product Information SheetMaterial Description: A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.Information Provided by Epoxy Technology
Glass Transition Temp, Tg <= 40.0 °C
<= 104 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® T7109-19 Electrically Insulating Epoxy Paste
Material Description: A flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is an alternative to EPO-TEK® T7109-17, de..
Glass Transition Temp, Tg >= 40.0 °C
>= 104 °F
Epoxyset Epoxiohm EO-30FST Electrically Conductive Epoxy Adhesive
EO-30-FST is two part, fast cure, silver filled, and high electrical conductivity epoxy adhesive. Both components are silver filled permitting a simple 1:1 mix ratio by weight. It has smooth creamy ..
Glass Transition Temp, Tg 40.0 °C
104 °F
dry, dynamic; DIN 53 736
Hippe PA 6 G
Thick-wall pre-forms, heavy semi-finished products. Transfusion of inserts (rolls, cores) and all types of large preforms.Information provided by Hippe.
Glass Transition Temp, Tg 40.0 °C
104 °F
DMA, E"
3D Systems Accura® accuGen™ HC and Ar Plastic for the SLA® 250 System
Our most versatile material combines accuracy, green strength, and build chamber environment independence. For the SLA® 250 system.Typical ApplicationsMulti-purpose modelsRTV mold patternsForm/Fit/..
Glass Transition Temp, Tg 40.0 °C
104 °F
DMA, E"
3D Systems Accura® accuGen™ HC and Ar Plastic for the SLA® 500 System
Our most versatile material combines accuracy, green strength, and build chamber environment independence. For the SLA® 500 system.All information provided by 3D Systems.
Glass Transition Temp, Tg 40.0 °C
104 °F
Atom Adhesives AA-BOND F125 Epoxy Adhesive
AA-BOND F125 is a 8 minutes gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. AA-BOND F125 is clear, two part system is easily mixed and used ..
Glass Transition Temp, Tg 40.0 °C
104 °F
TM R050-25
Resinlab® SEC1233 Silver Filled Epoxy Adhesive
Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit..
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