- HOME
- POLYMER SEARCH
- Thermoset
- Epoxy
- Epoxy, Electrically Conductive
- Epoxy Technology EPO-TEK® EJ2189-LV Electrically Conductive Epoxy
Epoxy Technology EPO-TEK® EJ2189-LV Electrically Conductive Epoxy
| Category | Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive |
| Manufacturer | Epoxy Technology |
| Trade Name | EPO-TEK® |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Epoxy Technology EPO-TEK® EJ2189-LV Electrically Conductive Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Low Viscosity, two component room temp curing conductive epoxyInformation Provided by Epoxy Technology
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 0.940 g/cc | 0.940 g/cc | Part B |
| 3.07 g/cc | 3.07 g/cc | Part A | |
| Particle Size | <= 45 µm | <= 45 µm | |
| Viscosity | 25000 - 45000 cP @Temperature 23.0 °C |
25000 - 45000 cP @Temperature 73.4 °F |
1 rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 41 | 41 | |
| Tensile Modulus | 1.47 GPa | 214 ksi | Storage |
| Shear Strength | 9.211 MPa | 1336 psi | Lap |
| >= 23.4 MPa | >= 3400 psi | Die |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 52.0 µm/m-°C | 28.9 µin/in-°F | Below Tg |
| 89.0 µm/m-°C | 49.4 µin/in-°F | Above Tg | |
| Thermal Conductivity | 2.00 W/m-K | 13.9 BTU-in/hr-ft²-°F | |
| Maximum Service Temperature, Air | 150 °C | 302 °F | Continuous |
| 250 °C | 482 °F | Intermittent | |
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| -55.0 °C | -67.0 °F | Intermittent | |
| Glass Transition Temp, Tg | >= 40.0 °C | >= 104 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Decomposition Temperature | 340 °C | 644 °F | Degradation Temperature |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | <= 0.00050 ohm-cm @Temperature 150 °C, Time 3600 sec |
<= 0.00050 ohm-cm @Temperature 302 °F, Time 1.00 hour |
|
| <= 0.0050 ohm-cm @Temperature 80.0 °C, Time 10800 sec |
<= 0.0050 ohm-cm @Temperature 176 °F, Time 3.00 hour |
||
| <= 0.0090 ohm-cm @Temperature 23.0 °C, Time 259000 sec |
<= 0.0090 ohm-cm @Temperature 73.4 °F, Time 72.0 hour |
| Chemical Properties | Metric | English | Comments |
|---|---|---|---|
| Ionic Impurities - Na (Sodium) | 27 ppm | 27 ppm | |
| Ionic Impurities - K (Potassium) | 2.0 ppm | 2.0 ppm | |
| Ionic Impurities - Cl (Chloride) | 201 ppm | 201 ppm |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 15.0 min @Temperature 150 °C |
0.250 hour @Temperature 302 °F |
|
| 180 min @Temperature 80.0 °C |
3.00 hour @Temperature 176 °F |
||
| 4320 min @Temperature 23.0 °C |
72.0 hour @Temperature 73.4 °F |
||
| Pot Life | 240 min | 240 min | |
| Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Consistency | Smooth flowing paste | |
| Ionic Impurities NH4 | 53 ppm | |
| Mix Ratio By Weight | 10:1 | |
| Number of Components | Two | |
| Thixotropic Index | 3.3 | |
| Weight Loss | 0.34% | 200°C |
| 0.8% | 250°C | |
| 1.58% | 300°C |
Users viewing this material also viewed the following:
- Multibase Multi-Flex® TPO 1047-1000 COMPOUND
- Plaskolite West Optix® CA-927 Impact Modified Acrylic Resin
- Dow Questra® WA550 High Heat Syndiotactic Polystyrene, 30% Glass Filled (discontinued **)
- Indium Corp. Indalloy 128 Pure Tin
- ExxonMobil Mobil Velocite 4
- Ensinger Tecaform™ FG Blue Food Grade Acetal (POM)
- Arlon R36580N008 0.008" ((0.203 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass
- Aptek 6103-A/B Epoxy Encapsulant
- 3M Scotch-Weld™ PR600B Plastic and Rubber Instant Adhesive
Copyright © lookpolymers.com All Rights Reserved