Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy

Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotropic version of EPO-TEK®E4110, suggested for applications requiring a screen printing process as well as jetting.Advantages & Application Notes: A thixotropic paste which enables ultra-fine pitch applications at the wafer or PCB/substrate packaging level. It may be dispensed, printed or jetted.Semiconductor Flip Chip Suggested Applications: Flip Chip attaching of IC’s direct to substrate or in semiconductor advanced plastic packages.“Dots” of E4110-PFC may be realized at 75µm diameter and 125µm pitch.Compatible with screen printing processes, whether mesh or stencil foils. The former requires > 200 mesh wires while the latter should be laser etched SST foil.Capable of curing at temperatures as low as 45°C for solder replacement.Medical Suggested Applications:Electrically conductive bridge when bonding Au-plated piezo-ceramic arrays to PCBs, used in ultrasonic devices.Flip chip attachment of photo-detector arrays found in X-ray and CT detectorsOpto-electronics Suggested ApplicationsElectrically conductive adhesive found in sensor and fiber optic devicesElectrical bridge of ITO contact pads to PCBs found in LCD/Displays and OLED’sFlex Circuits suggested Applciations.Solar / Photo-voltaic. Adhesive for electrically back-contacting, thin film, organic and dye sensitized solar cells.Flip Chip adhesive dots bridging RFID chips to antennae, or smart card IC packaging.Electrical bridge of Au/PZT arrays to Au/Kapton found on ink-jetting circuitsInformation Provided by Epoxy Technology