Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used. Advantages & Application Notes: Ease of use: smooth flowing paste allows for automated dispensing, stamping, brushing, or hand applications. In some cases, the low viscosity nature of the paste allows it to be sprayed onto targets.Suggested applications include: EMI and Rf shielding, ITO interconnects in LCDs, low temperature cryogenic cooling.Exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics. Hybrid / Micro-electronic adhesive including die-attach and substrate attach for Rf and Microwave devices.Bright and shiny silver epoxy; provides a metallic-like layer after cure.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	0.950 g/cc	0.950 g/cc	Part B
	3.10 g/cc	3.10 g/cc	Part A
Particle Size	<= 45 µm	<= 45 µm
Viscosity	800 - 1600 cP @Temperature 23.0 °C	800 - 1600 cP @Temperature 73.4 °F	100 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	60	60
Tensile Modulus	3.58 GPa	519 ksi	Storage
Shear Strength	8.729 MPa	1266 psi	Lap
	>= 11.7 MPa	>= 1700 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	48.0 µm/m-°C	26.7 µin/in-°F	Below Tg
	150 µm/m-°C	83.3 µin/in-°F	Above Tg
Thermal Conductivity	1.37 W/m-K	9.51 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	150 °C	302 °F	Continuous
	250 °C	482 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 40.0 °C	>= 104 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature	380 °C	716 °F	Degradation Temperature; TGA

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
	<= 0.00070 ohm-cm	<= 0.00070 ohm-cm	25°C/40-60%RH/3 Day cure

Chemical Properties	Metric	English
Ionic Impurities - Na (Sodium)	23 ppm	23 ppm
Ionic Impurities - K (Potassium)	31 ppm	31 ppm
Ionic Impurities - Cl (Chloride)	151 ppm	151 ppm

Processing Properties	Metric	English	Comments
Cure Time	15.0 min @Temperature 150 °C	0.250 hour @Temperature 302 °F	Minimum Bond Line
	180 min @Temperature 80.0 °C	3.00 hour @Temperature 176 °F	Minimum Bond Line
	360 min @Temperature 60.0 °C	6.00 hour @Temperature 140 °F	Minimum Bond Line
	4320 min @Temperature 23.0 °C	72.0 hour @Temperature 73.4 °F	Minimum Bond Line
Pot Life	240 min	240 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Clear/Colorless	Part B
	Silver	Part A
Consistency	Smooth flowing paste
Ionic Impurities NH4	23 ppm
Mix Ratio By Weight	10:1
Number of Components	Two
Thixotropic Index	2.1
Weight Loss	0.7%	200°C

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