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- Polymer Property : Glass Transition Temp, Tg = 104 °F
Polymer Property : Glass Transition Temp, Tg = 104 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
| Permabond ET500 Epoxy Resin PERMABOND ET500 is a two-part fast-setting epoxy adhesive which bonds to a wide variety of substrates such as wood, metal, ceramics and some plastics and composites. It cures rapidly at room tempera.. |
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| Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
| Permabond ET515 Epoxy Resin PERMABOND® ET515 is a 1:1 mixable epoxy adhesive. ET515 is a semi-flexible toughened adhesive with good adhesion to a variety of substrates such as wood, metal, ceramics and some plastics and compo.. |
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| Glass Transition Temp, Tg | 40.0 °C | 104 °F | TM R050-25 |
| Resinlab® EP1340 Medium Viscosity, Flame Retardant Epoxy Casting Resin System Resinlab™ EP1340 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for U.. |
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| Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
| Humiseal 2A64 Urethane Conformal Coating Humiseal 2A64 Urethane Conformal CoatingHigh moisture resistanceExcellent dielectrical propertiesExcellent chemical resistanceRepairableMIL-I-46058C ApprovedPasses thermal shock test (MIL-I-46058C)F.. |
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| Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
| Mallard Creek Polymers ROVENE® 4201 SBR Emulsion ROVENE® 4201 is a carboxylated styrene-butadiene emulsion that has a stiff or "boardy" hand. This binder is recommended for use as a crosslink-able binder for durable nonwovens such as floor main.. |
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| Glass Transition Temp, Tg | 40.0 °C | 104 °F | DIN EN ISO 3146 |
| GEHR Plastics PA 6 C Nylon 6 Cast Very stressed-relieved and high-molecular weight PA6.Temperature resistant from -40° to approx. 100°C and high stiffness, hardness and toughness. The good mechanical characteristics will be ac.. |
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| Glass Transition Temp, Tg | 40.0 °C | 104 °F | DSC |
| Solvay Specialty Polymers Kalix® 2955 Polyamide, High Performance (HPPA), Glass Fiber Kalix® 2955 is a 27% bio-sourced, PA 6,10-based compound with 55% by weight glass fiber reinforcement. This material is specifically formulated for high strength and stiffness applications where .. |
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| Glass Transition Temp, Tg | 40.0 °C | 104 °F | DSC |
| Solvay Specialty Polymers Kalix® 5950 HFFR Polyamide, High Performance (HPPA), 50% Glass Fiber Kalix® 5950 HFFR is a halogen-free, flame retardant (UL-94 V0 at 0.4 mm), highly reinforced polyamide material specifically formulated for high strength and stiffness applications where good impa.. |
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| Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
| Unitika elitel UE3240 Polyester, Pellet Medium Tg high elongation, Binder paint, Adhesive agentUNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as adh.. |
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| Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
| Unitika elitel UE3250 Polyester, Pellet High elongation type UE3240, Binder paint, Adhesive agentUNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as a.. |
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| Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
| Unitika elitel UE3320 Polyester, Flake Low molecular weight type UE3200, High OH type, Resin modifier, Resin raw materialUNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their application.. |
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| Glass Transition Temp, Tg | 40.0 - 80.0 °C | 104 - 176 °F | |
| Zeus ETFE Tubing ETFE (Ethylenetetrafluoroethylene), a copolymer of ethylene and tetrafluoroethylene, is used in applications requiring excellent impact, abrasion and stress cracking resistance. This polymer possess.. |
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| Glass Transition Temp, Tg | 40.0 °C | 104 °F | Ultimate Tg |
| Tra-Con Tra-Bond FS469 Clear High Strength Epoxy TRA-BOND FS469 is a clear low viscosity epoxy formulation designed for bonding and coating micro-electronics, laminations, optical components and laser assemblies. The low cure shrinkage (using a ro.. |
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| Glass Transition Temp, Tg | 40.0 °C | 104 °F | Ultimate Tg |
| Tra-Con Tra-Coat WCC2A Clear Dual-Cure Semi-Flexible Adhesive WCC2A is a clear, non-yellowing, dual-cure (UV and Heat) nameplate coating that is ideal for applications that require a glossy, "lens-like" finish. This photopolymer will also offer low shrinkage d.. |
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| Glass Transition Temp, Tg | 40.0 °C | 104 °F | Ultimate Tg |
| Tra-Con Tra-Bond 862-7 General Purpose Epoxy Adhesive TRA-BOND 862-7 semi-flexible, nonflowing epoxy paste adhesive is designed for general purpose applications. It is suitable for bonding materials with mismatched coefficients of expansion. This epoxy.. |
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| Glass Transition Temp, Tg | >= 40.0 °C | >= 104 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 302 Fast Setting, Optical Epoxy Product Description: EPO-TEK® 302 is a two component, fast-gelling, room temperature curing epoxy, designed for electronic, optical, medical, and general applications. Advantages & Application No.. |
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| Glass Transition Temp, Tg | >= 40.0 °C | >= 104 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other.. |
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| Glass Transition Temp, Tg | >= 40.0 °C | >= 104 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr.. |
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| Glass Transition Temp, Tg | >= 40.0 °C | >= 104 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® EJ2189-LV Electrically Conductive Epoxy Low Viscosity, two component room temp curing conductive epoxyInformation Provided by Epoxy Technology |
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| Glass Transition Temp, Tg | >= 40.0 °C | >= 104 °F | |
| Epoxy Technology EPO-TEK® EV2118-2 Silver-filled, electrically conductive epoxy Preliminary Product Information SheetMaterial Description: A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.Information Provided by Epoxy Technology |
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| Glass Transition Temp, Tg | 40.0 °C | 104 °F | dry, dynamic; DIN 53 736 |
| Hippe PA 6 G Thick-wall pre-forms, heavy semi-finished products. Transfusion of inserts (rolls, cores) and all types of large preforms.Information provided by Hippe. |
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| Glass Transition Temp, Tg | 40.0 °C | 104 °F | DMA, E" |
| 3D Systems Accura® accuGen™ HC and Ar Plastic for the SLA® 500 System Our most versatile material combines accuracy, green strength, and build chamber environment independence. For the SLA® 500 system.All information provided by 3D Systems. |
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| Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
| Atom Adhesives AA-BOND F125 Epoxy Adhesive AA-BOND F125 is a 8 minutes gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. AA-BOND F125 is clear, two part system is easily mixed and used .. |
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| Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
| Permabond ET514 Epoxy Resin PERMABOND ET514 is a 1:1 mixable epoxy adhesive. It has excellent resistance to impact and vibration and is ideal for structural bonding of metal, wood, composites and certain plastics. Its rapid cu.. |
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| Glass Transition Temp, Tg | 40.0 °C | 104 °F | TM R050-25 |
| Resinlab® SEC1233 Silver Filled Epoxy Adhesive Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit.. |
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