| Category | Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced |
| Manufacturer | Master Bond Inc. |
| Trade Name | |
| Port | Shanghai port,China |
| Trade Terms | EXW, FOB, CFR, CIF |
| Payment Terms | L/C, T/T, PayPal |
| Download PDF | Master Bond EP21TDCF-3 Two Component, Higher Viscosity Epoxy System.pdf |
| Price | EMAIL US sales@lookpolymers.com |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 50 - 55 | 50 - 55 | |
| Tensile Strength at Break | 51.7 MPa <br>@Temperature 23.9 °C |
7500 psi <br>@Temperature 75.0 °F |
|
| Tensile Modulus | 1.72 - 2.07 GPa <br>@Temperature 23.9 °C |
250 - 300 ksi <br>@Temperature 75.0 °F |
|
| Shear Strength | >= 13.8 MPa | >= 2000 psi | Al/Al, Bond |
| Peel Strength | 6.14 kN/m | 35.0 pli | T-peel |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Maximum Service Temperature, Air | 121 °C | 250 °F | |
| Minimum Service Temperature, Air | -73.3 °C | -100 °F |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 1.00e+14 ohm-cm | 1.00e+14 ohm-cm | |
| Dielectric Constant | 3.8 <br>@Frequency 60.0 Hz,<br> Temperature 25.0 °C |
3.8 <br>@Frequency 60.0 Hz,<br> Temperature 77.0 °F |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 60.0 - 120 min <br>@Temperature 23.9 °C |
1.00 - 2.00 hour <br>@Temperature 75.0 °F |
|
| 60.0 - 120 min <br>@Temperature 93.3 °C |
1.00 - 2.00 hour <br>@Temperature 200 °F |
||
| Pot Life | 15 - 25 min | 15 - 25 min | 100 gram mass |
| Shelf Life | 12.0 Month <br>@Temperature 23.9 °C |
12.0 Month <br>@Temperature 75.0 °F |
in unopened containers |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Mixing Ratio (A to B) | 1:1 | by weight or volume |