Category | Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced |
Manufacturer | Master Bond Inc. |
Trade Name | |
Port | Shanghai port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Master Bond EP21TDCF-3 Two Component, Higher Viscosity Epoxy System.pdf |
Price | EMAIL US sales@lookpolymers.com |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Hardness, Shore D | 50 - 55 | 50 - 55 | |
Tensile Strength at Break | 51.7 MPa @Temperature 23.9 °C |
7500 psi @Temperature 75.0 °F |
|
Tensile Modulus | 1.72 - 2.07 GPa @Temperature 23.9 °C |
250 - 300 ksi @Temperature 75.0 °F |
|
Shear Strength | >= 13.8 MPa | >= 2000 psi | Al/Al, Bond |
Peel Strength | 6.14 kN/m | 35.0 pli | T-peel |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
Maximum Service Temperature, Air | 121 °C | 250 °F | |
Minimum Service Temperature, Air | -73.3 °C | -100 °F |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Volume Resistivity | 1.00e+14 ohm-cm | 1.00e+14 ohm-cm | |
Dielectric Constant | 3.8 @Frequency 60.0 Hz, Temperature 25.0 °C |
3.8 @Frequency 60.0 Hz, Temperature 77.0 °F |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Cure Time | 60.0 - 120 min @Temperature 23.9 °C |
1.00 - 2.00 hour @Temperature 75.0 °F |
|
60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
||
Pot Life | 15 - 25 min | 15 - 25 min | 100 gram mass |
Shelf Life | 12.0 Month @Temperature 23.9 °C |
12.0 Month @Temperature 75.0 °F |
in unopened containers |
Descriptive Properties | Value | Comments |
---|---|---|
Mixing Ratio (A to B) | 1:1 | by weight or volume |