| Category | Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced |
| Manufacturer | Sumitomo Bakelite North America |
| Trade Name | |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Sumitomo Bakelite North America E 16521A Electrical Encapsulation Grade Epoxy.pdf |
| Price | EMAIL US sales@lookpolymers.com |
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Bulk Density | 0.800 g/cc | 0.0289 lb/in³ | ASTM D1895 |
| Density | 1.60 g/cc | 0.0578 lb/in³ | ASTM D792 |
| Water Absorption | 0.25 % @Temperature 50.0 °C, Time 173000 sec |
0.25 % @Temperature 122 °F, Time 48.0 hour |
ASTM D570 |
| Linear Mold Shrinkage | 0.0050 - 0.0070 cm/cm | 0.0050 - 0.0070 in/in | ASTM D955 |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Tensile Strength at Break | 62.0 MPa | 8990 psi | ASTM D638 |
| Flexural Strength | 104 MPa | 15100 psi | at rupture; ASTM D790 |
| Flexural Modulus | 7.00 GPa | 1020 ksi | ASTM D790 |
| Compressive Strength | 172 MPa | 24900 psi | ASTM D695 |
| Izod Impact, Notched | 0.190 J/cm | 0.356 ft-lb/in | ASTM D256 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear, Parallel to Flow | 40.0 µm/m-°C | 22.2 µin/in-°F | ASTM E831 |
| Deflection Temperature at 1.8 MPa (264 psi) | 122 °C | 252 °F | Post Baked; ASTM D648A |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Dielectric Constant | 4.4 @Frequency 1.00e+6 Hz |
4.4 @Frequency 1.00e+6 Hz |
wet; ASTM D150 |
| Dielectric Strength | 14.0 kV/mm @Frequency 60.0 Hz |
356 kV/in @Frequency 60.0 Hz |
step-by-step, dry; ASTM D149 |
| 17.0 kV/mm @Frequency 60.0 Hz |
432 kV/in @Frequency 60.0 Hz |
short time, dry; ASTM D149 | |
| Dissipation Factor | 0.015 @Frequency 1.00e+6 Hz |
0.015 @Frequency 1.00e+6 Hz |
wet; ASTM D150 |
| Arc Resistance | 120 sec | 120 sec | ASTM D495 |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Black | |
| Form | Granular | |
| Molding Method | Compression | |
| Transfer |