Cytec (Conap) FR-1210 / EA-117 Conapoxy® Resin / Conacure® Hardener

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer	Cytec
Trade Name
Port	Ningbo port,China
Trade Terms	EXW, FOB, CFR, CIF
Payment Terms	L/C, T/T, PayPal
Download PDF	Cytec (Conap) FR-1210 / EA-117 Conapoxy® Resin / Conacure® Hardener.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.Cytec (Conap) FR-1210 / EA-117 Conapoxy® Resin / Conacure® HardenerFilled version of RN-1200 with lower shrinkage, improved thermal properties and lower coefficient of expansion.Mix Ratio, Resin/Hardener (by weight): 100/10 Cure Type: Elevated Temperature

Physical Properties	Metric	English	Comments
Viscosity	10000 cP <br>@Temperature 25.0 °C	10000 cP <br>@Temperature 77.0 °F

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	85	85

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	155 °C	311 °F

Electrical Properties	Metric	English
Volume Resistivity	<= 4.00e+14 ohm-cm	<= 4.00e+14 ohm-cm
Dielectric Constant	4.0 <br>@Frequency 1000 Hz	4.0 <br>@Frequency 1000 Hz
Dielectric Strength	14.6 kV/mm	370 kV/in
Dissipation Factor	0.029 <br>@Frequency 1000 Hz	0.029 <br>@Frequency 1000 Hz

Processing Properties	Metric	English	Comments
Cure Time	>= 180 min <br>@Temperature 130 °C	>= 3.00 hour <br>@Temperature 266 °F
Pot Life	60.0 min <br>@Temperature 40.0 °C	60.0 min <br>@Temperature 104 °F	100 grams
	480 min <br>@Temperature 25.0 °C	480 min <br>@Temperature 77.0 °F	100 grams

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