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Aptek 6550-A/B Epoxy Encapsulant

Category	Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer	Aptek Laboratories
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Aptek 6550-A/B Epoxy Encapsulant.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

High thermal conductivity, microelectronic grade blob-top encapsulant. Ultra high purity. Excellent heat and moisture protection for sensitive chips/circuitry. Premixed frozen syringes available for robotic dispensers.Part A is black. Part B is white.Information provided by Aptek Laboratories, Inc.

Physical Properties	Metric	English	Comments
Viscosity	190000 cP	190000 cP	A Component; Spindle #7; speed 10 rpm; ASTM D1824
	200000 cP	200000 cP	B Component; Spindle #7; speed 10 rpm; ASTM D1824

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	95	95	Cured property; ASTM D2240
Adhesive Bond Strength	12.4 MPa	1800 psi	Al-to-Al Lap Shear; Cured property; ASTM D1002

Thermal Properties	Metric	English	Comments
CTE, linear	27.0 µm/m-°C @Temperature 20.0 °C	15.0 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 1; Perkin Elmer TMS-2
	95.0 µm/m-°C @Temperature 20.0 °C	52.8 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 2; Perkin Elmer TMS-2
Thermal Conductivity	1.21 W/m-K	8.41 BTU-in/hr-ft²-°F	COLORA
Glass Transition Temp, Tg	145 °C	293 °F	Cured property; Perkin Elmer TMS-2
Flash Point	>= 125 °C	>= 257 °F	A Component; ASTM D92
	>= 125 °C	>= 257 °F	B Component; ASTM D92

Electrical Properties	Metric	English	Comments
Volume Resistivity	7.50e+14 ohm-cm	7.50e+14 ohm-cm	Cured property; ASTM D257

Chemical Properties	Metric	English	Comments
Ionic Impurities - Na (Sodium)	15 ppm	15 ppm	Hydrolyzable
Ionic Impurities - K (Potassium)	5.0 ppm	5.0 ppm	Hydrolyzable
Ionic Impurities - Cl (Chloride)	15 ppm	15 ppm	Hydrolyzable

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