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Cytec (Conap) FR-1080 Conapoxy® Resin / Conacure® Hardener

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Cytec
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cytec (Conap) FR-1080 Conapoxy® Resin / Conacure® Hardener.pdf
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Material Notes:
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.Cytec (Conap) FR-1080 Conapoxy® Resin / Conacure® HardenerAn unfilled low viscosity system with high temperature operating capabilities.Mix Ratio, Resin/Hardener (by weight): 100/83 Cure Type: Elevated Temperature
Physical Properties Metric English Comments
Viscosity 2500 cP

@Temperature 25.0 °C
2500 cP

@Temperature 77.0 °F
Mechanical Properties Metric English Comments
Hardness, Shore D 90
90
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 180 °C
356 °F
Electrical Properties Metric English Comments
Volume Resistivity <= 9.70e+16 ohm-cm
<= 9.70e+16 ohm-cm
Dielectric Constant 3.12

@Frequency 1000 Hz
3.12

@Frequency 1000 Hz
Dielectric Strength 23.6 kV/mm
600 kV/in
Dissipation Factor 0.0040

@Frequency 1000 Hz
0.0040

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 180 min

@Temperature 150 °C
3.00 hour

@Temperature 302 °F
240 - 960 min

@Temperature 120 °C
4.00 - 16.0 hour

@Temperature 248 °F
Pot Life >= 120 min

@Temperature 25.0 °C
>= 120 min

@Temperature 77.0 °F
100 grams
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