Lord Adhesives Thermosetâ„¢ ME-525 Underfill Encapsulant

Category	Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer	Lord Adhesives
Trade Name	Thermoset™
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Lord Adhesives Thermosetâ„¢ ME-525 Underfill Encapsulant.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

LORD Thermosetâ„¢ ME-525 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and with the necessary structural strength to handle over-molding processes.All information provided by Lord.

Physical Properties	Metric	English	Comments
Specific Gravity	1.70 g/cc	1.70 g/cc
Water Absorption	<= 0.50 %	<= 0.50 %
Brookfield Viscosity	6000 cP @Temperature 25.0 Â°C	6000 cP @Temperature 77.0 Â°F	Spindle CP40 @ 5rpm

Mechanical Properties	Metric	English	Comments
Modulus of Elasticity	4.00 GPa	580 ksi	Storage
Shear Strength	64.98 MPa	9425 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	23.0 Âµm/m-Â°C	12.8 Âµin/in-Â°F	Alpha 1
	85.0 Âµm/m-Â°C	47.2 Âµin/in-Â°F	Alpha 2
Glass Transition Temp, Tg	120 Â°C	248 Â°F	TMA

Component Elements Properties	Metric	English	Comments
Potassium, K	<= 0.00010 %	<= 0.00010 %
Sodium, Na	<= 0.00050 %	<= 0.00050 %

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+15 ohm-cm @Temperature 25.0 Â°C	1.00e+15 ohm-cm @Temperature 77.0 Â°F

Processing Properties	Metric	English
Cure Time	15.0 min @Temperature 165 Â°C	0.250 hour @Temperature 329 Â°F
	30.0 min @Temperature 150 Â°C	0.500 hour @Temperature 302 Â°F
Pot Life	2160 min @Temperature 25.0 Â°C	2160 min @Temperature 77.0 Â°F
Gel Time	5.00 min @Temperature 150 Â°C	5.00 min @Temperature 302 Â°F
Shelf Life	6.00 Month @Temperature -40.0 Â°C	6.00 Month @Temperature -40.0 Â°F

Descriptive Properties	Value	Comments
Appearance	Black
Chloride (%)	< 0.001
Consistency	Low-Viscosity Liquid

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