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Parker Chomerics Tecknit® 0192/0193 Conductive Silicone Sealant/Adhesive
| Category | Polymer , Adhesive , Thermoset , Silicone |
| Manufacturer | Parker Chomerics |
| Trade Name | Tecknit® |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Parker Chomerics Tecknit® 0192/0193 Conductive Silicone Sealant/Adhesive.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Comments: Rec. bond line thickness: < 0.4 mm; flexible past.Typical Applications: Bonding Ag/Cu elastomer gaskets; thin bond gap.Information provided by Chomerics
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 3.80 g/cc | 3.80 g/cc | |
| Volatile Organic Compounds (VOC) Content | 0.00 g/l | 0.00 g/l | |
| Thickness | 254 microns | 10.0 mil |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Shear Strength | >= 1.38 MPa | >= 200 psi |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | <= 0.040 ohm-cm | <= 0.040 ohm-cm |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 10100 min @Temperature 24.0 °C |
168 hour @Temperature 75.2 °F |
|
| Shelf Life | 9.00 Month | 9.00 Month |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Filler | Ag/Cu | |
| Resin System | Silicone |
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