Songhan Plastic Technology Co.,Ltd.

Loctite® 3166 Deep Potting Epoxy

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced , Epoxy, Thermally Conductive
Manufacturer Loctite
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Loctite® 3166 Deep Potting Epoxy.pdf
  Online Service   lookpolymers   27660005
Material Notes:
PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies.For electronics assembly, Loctite offers deep potting, high adhesion, non-corrosive, and thermally conductive potting products. These can be cured with heat, UV light, or moisture.Loctite® 3166 Deep Potting EpoxyA heat cure soft epoxy for deep potting applications that require low shrinkage, thermal stability and environmental resistance. Cure Type: Heat Bonding Type: 2 part epoxy
Physical Properties Metric English Comments
Viscosity 1800 cP
1800 cP
Mechanical Properties Metric English Comments
Hardness, Shore A 15
Hardness, Shore OO 64
Thermal Properties Metric English Comments
CTE, linear 70.0 µm/m-°C

@Temperature 20.0 °C
38.9 µin/in-°F

@Temperature 68.0 °F
Glass Transition Temp, Tg -27.0 °C
-16.6 °F
Processing Properties Metric English Comments
Cure Time 180 min

@Temperature 80.0 °C
3.00 hour

@Temperature 176 °F
Pot Life 30.0 min

@Temperature 80.0 °C
30.0 min

@Temperature 176 °F
Gel Time 90.0 min
90.0 min
at 80°C
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