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- Polymer Property : Pot Life = 30.0 min
Polymer Property : Pot Life = 30.0 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Pot Life | 30.0 min @Temperature 23.0 °C |
30.0 min @Temperature 73.4 °F |
2X Starting Viscosity |
| Parker Chomerics THERM-A-FORM 1641 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co.. |
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| Pot Life | 30.0 min @Temperature 23.9 °C |
30.0 min @Temperature 75.0 °F |
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| ITW Devcon Flexane® Rubber Repair / Castable Urethane 80 Liquid, Black Information provided by ITW Devcon |
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| Pot Life | 30.0 min @Temperature 25.0 °C |
30.0 min @Temperature 77.0 °F |
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| Momentive Performance Materials RTV8111 White General Purpose Potting/Encapsulating Compound Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate.. |
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| Pot Life | 30.0 min @Temperature 25.0 °C |
30.0 min @Temperature 77.0 °F |
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| Momentive Performance Materials RTV6136 Potting/Encapsulating Gel Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth.. |
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| Pot Life | 30.0 min @Temperature 25.0 °C |
30.0 min @Temperature 77.0 °F |
100 grams |
| Trelleborg Emerson & Cuming Eccobond® 24 LV General Purpose Catalyst Emerson & Cuming 24 LV Eccobond® General Purpose CatalystFaster curing, shorter working life version of 23 LV. Recommended for small mass castings due to higher exotherm. Cure Type: Room Temp or He.. |
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| Pot Life | 30.0 min @Temperature 80.0 °C |
30.0 min @Temperature 176 °F |
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| Loctite® 3143 Deep Potting Epoxy PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies. For .. |
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| Pot Life | 30.0 min @Temperature 80.0 °C |
30.0 min @Temperature 176 °F |
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| Loctite® 3166 Deep Potting Epoxy PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies.For e.. |
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| Pot Life | 30.0 min @Temperature 25.0 °C |
30.0 min @Temperature 77.0 °F |
100 grams |
| Cytec (Conap) FR-1046 / EA-02 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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| Pot Life | 30.0 min @Temperature 25.0 °C |
30.0 min @Temperature 77.0 °F |
100 grams |
| Cytec (Conap) RN-1000 / EA-02 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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| Pot Life | 30.0 min @Temperature 25.0 °C |
30.0 min @Temperature 77.0 °F |
100 grams |
| Cytec (Conap) RN-1000 / EA-028 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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| Pot Life | 30.0 min @Temperature 25.0 °C |
30.0 min @Temperature 77.0 °F |
100 grams |
| Cytec (Conap) RN-1200 / EA-02 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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| Pot Life | 30.0 min @Temperature 25.0 °C |
30.0 min @Temperature 77.0 °F |
100 grams |
| Cytec (Conap) RN-1210 / EA-02 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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| Pot Life | 30.0 - 35.0 min @Temperature 25.0 °C |
30.0 - 35.0 min @Temperature 77.0 °F |
1 lbm |
| Cytec EN-2543 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s.. |
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| Pot Life | <= 30.0 min @Temperature 25.0 °C |
<= 30.0 min @Temperature 77.0 °F |
100 g |
| Armstrong A-1/A Epoxy Adhesive A brown epoxy paste formulated with enhanced wetting capabilities to hard rubbers and rigid thermoplastics. Has low outgassing characteristics at temperatures below 250°FInformation provided by El.. |
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| Pot Life | <= 30.0 min @Temperature 25.0 °C |
<= 30.0 min @Temperature 77.0 °F |
100 g |
| Armstrong A-2/A Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac.. |
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| Pot Life | <= 30.0 min @Temperature 25.0 °C |
<= 30.0 min @Temperature 77.0 °F |
100 g |
| Armstrong A-3/A Epoxy Adhesive A Jet black epoxy paste especially formulated for bonding rigid materials. When used with Activator A or E, A-3 exhibits excellent bonding properties to phenolics, precious stones, ceramics, glass,.. |
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| Pot Life | <= 30.0 min @Temperature 25.0 °C |
<= 30.0 min @Temperature 77.0 °F |
100 g |
| Armstrong A-4/A Epoxy Adhesive Is a heavy, non-metallic filled, gray paste epoxy that provides excellent thixotropic non-sag bond lines. It can be used for small volume casting applications.Information provided by Ellsworth Adhe.. |
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| Pot Life | <= 30.0 min @Temperature 25.0 °C |
<= 30.0 min @Temperature 77.0 °F |
100 g |
| Armstrong A-5/A Epoxy Adhesive Information provided by Ellsworth Adhesives. |
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| Pot Life | <= 30.0 min @Temperature 25.0 °C |
<= 30.0 min @Temperature 77.0 °F |
100 g |
| Armstrong C-1/A Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor.. |
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| Pot Life | 30.0 min | 30.0 min | |
| Atom Adhesives AA-BOND 2113 Epoxy Adhesive AA-BOND 2113 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flow ability and wetting characteristics, and adheres strongly to gla.. |
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| Pot Life | 30.0 min | 30.0 min | uncured |
| Atom Adhesives AA-BOND 2123 Epoxy Adhesive AA-BOND 2123 is a versatile steel metal/epoxy adhesive formulation developed for modern industrial repair, casting and bonding applications where a steel-like or cast iron finish is required. AA-BON.. |
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| Pot Life | 30.0 min | 30.0 min | uncured |
| Atom Adhesives AA-BOND 2153 Epoxy Adhesive AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits.. |
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| Pot Life | 30.0 min | 30.0 min | uncured |
| Atom Adhesives AA-BOND G298 Epoxy Adhesive AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro.. |
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| Pot Life | 30.0 min | 30.0 min | 100g, uncured |
| Atom Adhesives AA-CARB 61 Epoxy Adhesive AA-CARB 61 is an epoxy adhesive and coating formulation based on conductive carbon. AA-CARB 61 is recommended for electronic bonding and sealing applications that require both fine electrical and me.. |
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| Pot Life | 30.0 - 45.0 min @Temperature 25.0 °C |
30.0 - 45.0 min @Temperature 77.0 °F |
1-2 lbs |
| Abatron AboCast/AboCure 4-4/50-12 Casting Epoxy for Tooling Standard casting compound for molds or patterns of any size, that can be machined with common metal working tools, engraving and reproduction molds.Main Advantages: FastBest rigid, chemical, and hea.. |
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| Pot Life | 30.0 min | 30.0 min | |
| Atom Adhesives AA-BOND 2116 Epoxy Adhesive AA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics, aerospace, and industrial applications where.. |
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| Pot Life | 30.0 - 40.0 min @Temperature 20.0 °C |
30.0 - 40.0 min @Temperature 68.0 °F |
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| Permabond ET514 Epoxy Resin PERMABOND ET514 is a 1:1 mixable epoxy adhesive. It has excellent resistance to impact and vibration and is ideal for structural bonding of metal, wood, composites and certain plastics. Its rapid cu.. |
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| Pot Life | 30.0 min | 30.0 min | uncured |
| Atom Adhesives AA-BOND 2101 Epoxy Adhesive AA-BOND 2101 is a clear medium viscosity epoxy formulation recommended for laminating, bonding, repair and other adhesive applications where the combination of superior structural, mechanical and el.. |
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