Polymer Property : Pot Life = 30.0 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Pot Life	30.0 - 45.0 min @Temperature 20.0 °C	30.0 - 45.0 min @Temperature 68.0 °F
Permabond ET536 Epoxy Resin PERMABOND ET536 is a two-part, 1:1 mixable epoxy adhesive with good adhesion to a variety of substrates such as wood, metal, ceramics and some plastics and composites. Permabond ET536 forms tough bo..
Pot Life	30.0 min @Temperature 25.0 °C	30.0 min @Temperature 77.0 °F
Resin Technology Group UV MX-2240 Multi-Functional Hybrid, UV-Curing, Micro-Electronic System Mix ratio 2 to 1 by volume.UV-MX 2240 is a low-viscosity, water-white photo/ chemical cross-linking encapsulant/sealant designed for micro-electronic applications. This two-part, Hybrid UV-epoxy bas..
Pot Life	30.0 min @Temperature 23.9 Â°C	30.0 min @Temperature 75.0 Â°F
ITW Devcon FlexaneÂ® Rubber Repair / Castable Urethane 80 Liquid, Black Information provided by ITW Devcon
Pot Life	30.0 min @Temperature 25.0 Â°C	30.0 min @Temperature 77.0 Â°F
Momentive Performance Materials RTV8111 White General Purpose Potting/Encapsulating Compound Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate..
Pot Life	30.0 min @Temperature 25.0 Â°C	30.0 min @Temperature 77.0 Â°F
Momentive Performance Materials RTV6136 Potting/Encapsulating Gel Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth..
Pot Life	30.0 min @Temperature 80.0 °C	30.0 min @Temperature 176 °F
Loctite® 3143 Deep Potting Epoxy PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies. For ..
Pot Life	30.0 min @Temperature 80.0 °C	30.0 min @Temperature 176 °F
Loctite® 3166 Deep Potting Epoxy PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies.For e..
Pot Life	30.0 min @Temperature 25.0 °C	30.0 min @Temperature 77.0 °F	100 grams
Cytec (Conap) FR-1046 / EA-02 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Pot Life	30.0 min @Temperature 25.0 °C	30.0 min @Temperature 77.0 °F	100 grams
Cytec (Conap) RN-1000 / EA-02 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Pot Life	30.0 min @Temperature 25.0 °C	30.0 min @Temperature 77.0 °F	100 grams
Cytec (Conap) RN-1000 / EA-028 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Pot Life	30.0 min @Temperature 25.0 °C	30.0 min @Temperature 77.0 °F	100 grams
Cytec (Conap) RN-1200 / EA-02 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Pot Life	30.0 min @Temperature 25.0 °C	30.0 min @Temperature 77.0 °F	100 grams
Cytec (Conap) RN-1210 / EA-02 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Pot Life	30.0 - 35.0 min @Temperature 25.0 °C	30.0 - 35.0 min @Temperature 77.0 °F	1 lbm
Cytec EN-2543 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
Pot Life	<= 30.0 min @Temperature 25.0 °C	<= 30.0 min @Temperature 77.0 °F	100 g
Armstrong A-1/A Epoxy Adhesive A brown epoxy paste formulated with enhanced wetting capabilities to hard rubbers and rigid thermoplastics. Has low outgassing characteristics at temperatures below 250°FInformation provided by El..
Pot Life	<= 30.0 min @Temperature 25.0 °C	<= 30.0 min @Temperature 77.0 °F	100 g
Armstrong A-2/A Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac..
Pot Life	<= 30.0 min @Temperature 25.0 °C	<= 30.0 min @Temperature 77.0 °F	100 g
Armstrong A-3/A Epoxy Adhesive A Jet black epoxy paste especially formulated for bonding rigid materials. When used with Activator A or E, A-3 exhibits excellent bonding properties to phenolics, precious stones, ceramics, glass,..
Pot Life	<= 30.0 min @Temperature 25.0 °C	<= 30.0 min @Temperature 77.0 °F	100 g
Armstrong A-4/A Epoxy Adhesive Is a heavy, non-metallic filled, gray paste epoxy that provides excellent thixotropic non-sag bond lines. It can be used for small volume casting applications.Information provided by Ellsworth Adhe..
Pot Life	<= 30.0 min @Temperature 25.0 °C	<= 30.0 min @Temperature 77.0 °F	100 g
Armstrong A-5/A Epoxy Adhesive Information provided by Ellsworth Adhesives.
Pot Life	<= 30.0 min @Temperature 25.0 °C	<= 30.0 min @Temperature 77.0 °F	100 g
Armstrong C-1/A Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor..
Pot Life	30.0 min	30.0 min	uncured
Atom Adhesives AA-BOND 2104 Epoxy Adhesive AA-BOND 2104 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s..
Pot Life	30.0 min	30.0 min
Atom Adhesives AA-BOND 2113 Epoxy Adhesive AA-BOND 2113 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flow ability and wetting characteristics, and adheres strongly to gla..
Pot Life	30.0 min	30.0 min	uncured
Atom Adhesives AA-BOND 2123 Epoxy Adhesive AA-BOND 2123 is a versatile steel metal/epoxy adhesive formulation developed for modern industrial repair, casting and bonding applications where a steel-like or cast iron finish is required. AA-BON..
Pot Life	30.0 min	30.0 min	uncured
Atom Adhesives AA-BOND G298 Epoxy Adhesive AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro..
Pot Life	30.0 min	30.0 min
Atom Adhesives AA-BOND 2112 Epoxy Adhesive AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s..
Pot Life	30.0 min	30.0 min
Atom Adhesives AA-BOND 2116 Epoxy Adhesive AA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics, aerospace, and industrial applications where..
Pot Life	30.0 min	30.0 min	uncured
Atom Adhesives AA-BOND F110 Epoxy Adhesive AA-BOND F110 is a rigid, optically clear adhesive with a very low viscosity. AA-BOND F110 is room temperature system an excellent choice for thin bond-line assembly and repair applications of prisms..
Pot Life	30.0 min	30.0 min
Atom Adhesives AA-BOND F156 Epoxy Adhesive AA-BOND F156 is a black, solvent free thixotropic epoxy recommended for high quality photographic industry, laminating, production and repair applications where a room temperature cure optically opa..
Pot Life	30.0 - 40.0 min @Temperature 20.0 °C	30.0 - 40.0 min @Temperature 68.0 °F
Permabond ET514 Epoxy Resin PERMABOND ET514 is a 1:1 mixable epoxy adhesive. It has excellent resistance to impact and vibration and is ideal for structural bonding of metal, wood, composites and certain plastics. Its rapid cu..
Pot Life	30.0 - 100000 min	30.0 - 100000 min	Average value: 5460 min Grade Count:19
Overview of materials for Epoxy, Cast, Metal Filled This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Cast, Aluminum Filled". Each property range of values reported is minimum and maximum values of a..