Cytec (Conap) FR-1610 / EA-039 Conapoxy® Resin / Conacure® Hardener

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer	Cytec
Trade Name
Port	Shanghai port,China
Trade Terms	EXW, FOB, CFR, CIF
Payment Terms	L/C, T/T, PayPal
Download PDF	Cytec (Conap) FR-1610 / EA-039 Conapoxy® Resin / Conacure® Hardener.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.Cytec (Conap) FR-1610 / EA-039 Conapoxy® Resin / Conacure® HardenerA filled, high performance flexible epoxy casting system. Little change in hardness after aging at 155°C. Recommended for potting and encapsulating transformers, coils and similar electrical devices.Mix Ratio, Resin/Hardener (by weight): 100/25 Cure Type: Elevated Temperature

Physical Properties	Metric	English	Comments
Viscosity	11000 cP <br>@Temperature 25.0 °C	11000 cP <br>@Temperature 77.0 °F

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	82	82

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	155 °C	311 °F

Electrical Properties	Metric	English
Volume Resistivity	<= 2.10e+14 ohm-cm	<= 2.10e+14 ohm-cm
Dielectric Constant	3.8 <br>@Frequency 1000 Hz	3.8 <br>@Frequency 1000 Hz
Dielectric Strength	15.0 kV/mm	380 kV/in
Dissipation Factor	0.012 <br>@Frequency 1000 Hz	0.012 <br>@Frequency 1000 Hz

Processing Properties	Metric	English	Comments
Cure Time	120 min <br>@Temperature 140 °C	2.00 hour <br>@Temperature 284 °F
Pot Life	180 min <br>@Temperature 120 °C	180 min <br>@Temperature 248 °F	100 grams
	480 min <br>@Temperature 25.0 °C	480 min <br>@Temperature 77.0 °F	100 grams

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