Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Hexion Bakelite™ MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength  (d

Category Polymer , Thermoset , Melamine , Melamine-Phenolic Copolymer , Phenolic
Manufacturer
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexion Bakelite™ MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength  (d.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Melamine/phenolic molding compound, inorganically filled, glass fiber reinforced, good temperature stability, high level of mechanical properties, copper adhesive, flammability UL 94/V-0/1.6 mm (not listed).Application areas: Commutators (fuel pumps, actuators, HVAC motors, fan motors, window lift motors, ABS, wiper motors, garden appliances, household appliances, power tools, universal motors)Information provided by Bak AGBak AG became a part of Hexion in 2005.
Physical Properties Metric English Comments
Density 1.81 g/cc
0.0654 lb/in³
ISO 1183
Apparent Bulk Density 0.700 g/cc
0.0253 lb/in³
ISO 60
Linear Mold Shrinkage, Flow -0.000500 cm/cm
-0.000500 in/in
Compression molding; ISO 2577
0.00040 cm/cm
0.00040 in/in
Injection molding; ISO 2577
Mechanical Properties Metric English Comments
Ball Indentation Hardness 300 MPa
43500 psi
H 961/30; ISO 2039/P1
Tensile Strength at Break 60.0 MPa
8700 psi
5 mm/min; ISO 527 - 1/2
Tensile Modulus 12.5 GPa
1810 ksi
1 mm/min; ISO 527 - 1/2
Flexural Strength 105 MPa
15200 psi
2 mm/min; ISO 178
Flexural Modulus 12.5 GPa
1810 ksi
ISO 178
Compressive Strength 160 MPa
23200 psi
Test specimen flat tested; ISO 604
Charpy Impact Unnotched 0.700 J/cm²

@Temperature 23.0 °C
3.33 ft-lb/in²

@Temperature 73.4 °F
ISO 179-1/2 eU
Charpy Impact, Notched 0.200 J/cm²

@Temperature 23.0 °C
0.952 ft-lb/in²

@Temperature 73.4 °F
ISO 179-1/2 eA
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 150 °C
302 °F
<20000 hours; IEC 60216-P1
190 °C
374 °F
< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa 135 °C
275 °F
ISO 75-2
Shrinkage 0.250 %

@Temperature 110 °C
0.250 %

@Temperature 230 °F
Compression molding; ISO 2577
0.290 %

@Temperature 110 °C,
Time 605000 sec
0.290 %

@Temperature 230 °F,
Time 168 hour
Injection molding; ISO 2577
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+12 ohm-cm
1.00e+12 ohm-cm
IEC 60093
Surface Resistance 1.00e+11 ohm
1.00e+11 ohm
IEC 60093
Dielectric Constant 7.0

@Frequency 100 Hz
7.0

@Frequency 100 Hz
IEC 60250
Dielectric Strength 30.0 kV/mm

@Thickness 1.00 mm
762 kV/in

@Thickness 0.0394 in
IEC 60243-P1
Dissipation Factor 0.080

@Frequency 100 Hz
0.080

@Frequency 100 Hz
IEC 60250
Comparative Tracking Index 300 V
300 V
Test liquid A; IEC 60112
Processing Properties Metric English Comments
Feed Temperature 60.0 - 75.0 °C
140 - 167 °F
Injection molding
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Melt Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Mold Temperature 160 - 170 °C
320 - 338 °F
Injection molding
160 - 170 °C
320 - 338 °F
Compression molding
Injection Pressure >= 15.0 MPa
>= 2180 psi
Compression and injection cavity mold pressure
Back Pressure 0.500 - 2.00 MPa
72.5 - 290 psi
Injection molding
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Descriptive Properties Value Comments
Holding Pressure Approximately 40-60% of injection pressure
Moisture Absorption 13 mg
ISO 62, 24 hours at 23°C
Copyright © lookpolymers.com All Rights Reserved