- HOME
- POLYMER SEARCH
- Polymer Property : Cure Time = 0.500 hour
Polymer Property : Cure Time = 0.500 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 140 °C |
0.500 hour @Temperature 284 °F |
|
| Parker Chomerics CHO-FORM® 5515 Robotically Dispensed Gasketing Description: CHO-FORM® 5515 One-component, thermal cure silicone system, with Ni/Graphite filler. Minimum cure temperature is 100°C (212°F). A low-cost solution for EMI shielding, it is specially.. |
|||
| Cure Time | 30.0 - 60.0 min | 0.500 - 1.00 hour | working strength |
| Permabond TA436 Toughened Acrylic Adhesive PERMABOND TA436 is a structural acrylic adhesive designed primarily for bonding metals, ferrites, ceramics and some thermoplastics. Permabond TA436 is a no-mix system which obtains handling strength.. |
|||
| Cure Time | 30.0 min @Temperature 121 °C |
0.500 hour @Temperature 250 °F |
|
| Parker Chomerics CHO-FLEX 4432 Conductive Ink CHO-FLEX polyester inks were developed for the membrane keyboard and sensor industries. The ink bond to Mylar films, and can be creased, heat-formed or scratched without affecting their performance... |
|||
| Cure Time | 30.0 min @Temperature 210 °C |
0.500 hour @Temperature 410 °F |
|
| Lord Adhesives 8641 Polymer Resistor Composition LORD 8600 series polymer resistor compositions are designed for screen print application onto a wide range of substrates.All information provided by Lord. |
|||
| Cure Time | 30.0 - 60.0 min @Temperature 125 °C |
0.500 - 1.00 hour @Temperature 257 °F |
|
| Lord Adhesives Thermosetâ„¢ MS-330 Silicone Board Level Encapsulant LORD Thermosetâ„¢ MS-330 encapsulant is a one component silicone specifically designed for use on high-frequency devices including Bluetooth applications. This silicone encapsulant offers excelle.. |
|||
| Cure Time | 30.0 min @Temperature 130 °C |
0.500 hour @Temperature 266 °F |
|
| Gwent Electronic Materials C2010903D2 Curable Silver Range This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive adhesive that combines good adhesion with excellent electrical properties.. |
|||
| Cure Time | 30.0 min @Temperature 160 °C |
0.500 hour @Temperature 320 °F |
|
| Gwent Electronic Materials C2030529D3 Gold Via Ink This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive adhesive that combines good adhesion and electrical conductivity with che.. |
|||
| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Gwent Electronic Materials D2060131D1 Dielectric Paste This Material is a white colored screen printable polymer dielectric, suitable for defining electrode areas and forms a protective layer over the electrode tracking during immersion of the electrode.. |
|||
| Cure Time | >= 30.0 min | >= 0.500 hour | |
| Trelleborg Emerson & Cuming Stycast® XT-5038-9 Two-Component Epoxy Flame Retardant Encapsulant Features and Typical ApplicationsProvide flame resistance down to 1/8 of an inch. These products also offer various other features such as thermal shock protection, low viscosity, and thermal conduc.. |
|||
| Cure Time | 30.0 min @Temperature 152 °C |
0.500 hour @Temperature 305 °F |
|
| TSE Industries Millathane® 5004 Millable Polyurethane Elastomer with 40 PHR N330 (HAF) Black MILLATHANE 5004 is a millable polyurethane elastomer having excellent processing characteristics. MILLATHANE 5004 stocks can be readily processed on conventional rubber equipment. Vulcanization is c.. |
|||
| Cure Time | 30.0 min @Temperature 142 °C |
0.500 hour @Temperature 287 °F |
|
| TSE Industries Millathane® CM Millable Polyether Urethane Rubber, Hardness 66A MILLATHANE CM is a sulfur and peroxide curable polyether urethane rubber. Its outstanding property is its great resistance to abrasion, which makes it of special interest for articles that are subje.. |
|||
| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
Full Cure |
| Loctite® 3534 Glob Top Encapsulant COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
|||
| Cure Time | 30.0 min | 0.500 hour | |
| Loctite® 641 Controlled Strength Retaining Compound RetainersLoctite Corporation, the pioneer of anaerobic adhesives, has applied this technology to create retaining compounds that increase the shear strength of cylindrical, non-threaded assemblies. .. |
|||
| Cure Time | 30.0 min | 0.500 hour | On-Part Life |
| Loctite® 736 Trichloroethylene isopropyl alcohol Base Surface Primer Loctite offers a complete line of surface preparation products to ensure the maximum performance of Loctite® Adhesives and Sealants.Loctite® Accelerators are used to increase the cure speed and ga.. |
|||
| Cure Time | 30.0 min @Temperature 75.0 °C |
0.500 hour @Temperature 167 °F |
minimum, Pre-cure |
| Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
|||
| Cure Time | 30.0 min @Temperature 200 °C |
0.500 hour @Temperature 392 °F |
|
| Epoxy Technology EPO-TEK® EK1000 Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding .. |
|||
| Cure Time | 30.0 min @Temperature 180 °C |
0.500 hour @Temperature 356 °F |
|
| Dow BETAMATE™ 5103-2 Epoxy BETAMATE™ 5103-2 is a one component heat curing Epoxy paste adhesive. The material is readily pumped at ambient temperatures. It shows excellent adhesion to automotive steel, including coated ste.. |
|||
| Cure Time | 30.0 - 60.0 min | 0.500 - 1.00 hour | Air Set prior to curing |
| Aremco Aremco-Seal™ 613 High Temperature Specialty Coatings Glass |
|||
| Cure Time | 30.0 min | 0.500 hour | Pressing Time |
| 3M 5010 Polyurethane Multi-Purpose Adhesive 3M™ Polyurethane Multi-Purpose Adhesive 5010 is a one component, fast curing adhesive which forms a rigid permanent bond. 3M 5010 bonds to a wide variety of materials including wood, foam panels, f.. |
|||
| Cure Time | 30.0 min @Temperature 871 °C |
0.500 hour @Temperature 1600 °F |
|
| Aremco Aremco-Seal™ 617 High Temperature Specialty Coatings Glass Glass coating for producing hermetic seals in porous ceramics and refractories to 1450 ºF. Used for sealing high vacuum components, resistance temperature devices, and other electrical sensors. |
|||
| Cure Time | 30.0 - 720 min @Temperature 45.0 - 150 °C |
0.500 - 12.0 hour @Temperature 113 - 302 °F |
Average value: 284 min Grade Count:11 |
| Overview of materials for Epoxy, Cast, Metal Filled This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Cast, Aluminum Filled". Each property range of values reported is minimum and maximum values of a.. |
|||
| Cure Time | 30.0 - 240 min | 0.500 - 4.00 hour | Full Cure; Primed |
| Loctite® Gasket Eliminator® 510 Flange Sealant Anaerobic GasketingLoctite® 510 High Temperature Rigid Cure Gasket Eliminator® Flange SealantProduct has a temperature range to 400ºF with excellent solvent and chemical resistance. Makes or dre.. |
|||
Copyright © lookpolymers.com All Rights Reserved