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Parker Chomerics CHO-FORM® 5515 Robotically Dispensed Gasketing

Category Polymer , Thermoset , Silicone
Manufacturer Parker Chomerics
Trade Name CHO-FORM®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics CHO-FORM® 5515 Robotically Dispensed Gasketing.pdf
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Material Notes:
Description: CHO-FORM® 5515 One-component, thermal cure silicone system, with Ni/Graphite filler. Minimum cure temperature is 100°C (212°F). A low-cost solution for EMI shielding, it is specially formulated to reduce galvanic activity between the housing and EMI gasket, and for use on outdoor applications requiring long-term corrosion resistance.Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 1.80 g/cc
1.80 g/cc
ASTM D792
Mechanical Properties Metric English Comments
Hardness, Shore A 50 - 75
50 - 75
ASTM D2240
Tensile Strength >= 3.10 MPa
>= 450 psi
ASTM D412
Elongation at Break >= 100 %
>= 100 %
ASTM D412
Compression Set <= 25 %

@Temperature 85.0 °C,
Time 79200 sec
<= 25 %

@Temperature 185 °F,
Time 22.0 hour
ASTM D395 Method B
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 100 °C
212 °F
Electrical Properties Metric English Comments
Volume Resistivity <= 0.20 ohm-cm
<= 0.20 ohm-cm
Initial; MIL-G-83528 Para. 4.6.11
<= 0.30 ohm-cm
<= 0.30 ohm-cm
Aged; MIL-G-83528 Para. 4.6.15
Shielding Effectiveness 75 - 85 dB
75 - 85 dB
modified specimen 0.85 mm x 1.0 mm bead with plastic bolts; MIL-G-83528 Para. 4.6.12
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 140 °C
0.500 hour

@Temperature 284 °F
Descriptive Properties Value Comments
Adhesion >8 N/cm2
WI 038
Cure System Heat
Filler Ni/Graphite
Mix Ratio 1-part
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