Processing Properties | Metric | English | Comments |
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Cure Time | 120 - 300 min @Temperature 25.0 °C |
2.00 - 5.00 hour @Temperature 77.0 °F |
De-mold Time |
Northstar Polymers MPP-W43C Polyurethane Gel MPP-W43C is a polyurethane gel formulation specifically designed for padding and cushioning applications that require Shore Durometer OOO scale hardness materials. With this material, a user can ob.. |
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Cure Time | 240 - 300 min @Temperature 25.0 °C |
4.00 - 5.00 hour @Temperature 77.0 °F |
De-mold Time |
Northstar Polymers MYP-V40A Polyurethane Filler Gel This polyurethane casting material is developed for applications that require inexpensive liquid resin filler such as encapsulation of a large electric components or puncture-free tire for low-speed.. |
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Cure Time | 240 - 300 min @Temperature 23.9 °C |
4.00 - 5.00 hour @Temperature 75.0 °F |
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Master Bond EP21TDC-4 Two Component, Highly Flexible Epoxy System Master Bond Polymer System EP21TDC-4 is a two component, flexible epoxy resin system for high performance bonding, sealing and coating. It is formulated to cure at ambient temperatures or more quick.. |
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Cure Time | 240 - 300 min @Temperature 23.9 °C |
4.00 - 5.00 hour @Temperature 75.0 °F |
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Master Bond EP21TDC-4ND Two component, highly flexibilized epoxy for bonding, sealing and coating Product Description: Master Bond EP21TDC-4ND is a two component, very flexible epoxy system for high performance bonding, sealing and coating with a non-drip consistency. It has a one to four mix ra.. |
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Cure Time | 240 - 300 min @Temperature 93.3 °C |
4.00 - 5.00 hour @Temperature 200 °F |
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Master Bond EP30-D10 Abrasion Resistant, Flexible Adhesive Compound Description: Master Bond Polymer System EP30-D10 is a versatile two component, abrasion resistant elastomer featuring superior strength, toughness and chemical resistance for high performance bondin.. |
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Cure Time | 120 - 300 min @Temperature 65.0 °C |
2.00 - 5.00 hour @Temperature 149 °F |
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Tra-Con Tra-Cast F311 Optically Transparent Semi-Flexible Casting System TRA-CAST F311 is a clear, low viscosity epoxy formulation developed for molding, embedding, casting and potting applications where clarity, toughness, long pot-life and superior impact properties ar.. |
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Cure Time | 180 - 300 min @Temperature 23.9 °C |
3.00 - 5.00 hour @Temperature 75.0 °F |
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Master Bond EP21LSCL-1 Two Component, Room Temperature Curing Epoxy Resin Product Description: Master Bond Polymer System EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring optical clarity as well as non-yellowing properties. This system can be used.. |
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Cure Time | 180 - 300 min @Temperature 60.0 °C |
3.00 - 5.00 hour @Temperature 140 °F |
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Cytec (Conap) FR-1271 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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Cure Time | 180 - 300 min @Temperature 60.0 °C |
3.00 - 5.00 hour @Temperature 140 °F |
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Cytec (Conap) FR-1272 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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Cure Time | 180 - 300 min @Temperature 60.0 °C |
3.00 - 5.00 hour @Temperature 140 °F |
|
Cytec (Conap) FR-1273 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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Cure Time | 180 - 300 min @Temperature 60.0 °C |
3.00 - 5.00 hour @Temperature 140 °F |
|
Cytec (Conap) FR-1274 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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Cure Time | 240 - 300 min @Temperature 25.0 °C |
4.00 - 5.00 hour @Temperature 77.0 °F |
tack free |
Cytec Conathane® CC-1155 (Conap) Polyurethane Two-component Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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Cure Time | 240 - 300 min @Temperature 25.0 °C |
4.00 - 5.00 hour @Temperature 77.0 °F |
tack free |
Cytec Conathane® CC-1155-35 (Conap) Polyurethane Two-component Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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Cure Time | 240 - 300 min @Temperature 25.0 °C |
4.00 - 5.00 hour @Temperature 77.0 °F |
tack free |
Cytec Conathane® CC-1195 (Conap) Polyurethane Two-component Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |