Polymer Property : Cure Time = 0.300 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	18.0 min @Temperature 22.0 °C	0.300 hour @Temperature 71.6 °F	50% RH; Handling Time
Parker Chomerics CHO-FORM 5526 EMI Shielding Material Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
Cure Time	18.0 min @Temperature 22.0 °C	0.300 hour @Temperature 71.6 °F	50% RH, Tack Free Time
Parker Chomerics ParPHorm® 1800 Non-Conductive Form-in-Place Gasket Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
Cure Time	18.0 - 40.2 min @Temperature 80.0 - 100 °C	0.300 - 0.670 hour @Temperature 176 - 212 °F
Master Bond EP62-1Med USP Class VI Two Component Epoxy Resin System Master Bond EP62-1Med is a two component epoxy system that has an exceptionally long working life at ambient temperatures and cures rapidly at moderately elevated temperatures. It has a 100 to 10 mi..
Cure Time	18.0 min @Temperature 90.0 °C	0.300 hour @Temperature 194 °F
Trelleborg Emerson & Cuming Eccobond® 927-10 E Needle Bonding Epoxy Adhesive Emerson & Cuming 927-10 E Eccobond® Needle Bonding Epoxy AdhesiveOne component, fast curing, epoxy adhesive for needle bonding with polypropylene hubs. Also recommended for bonding sealing or insul..
Cure Time	18.0 min @Temperature 120 °C	0.300 hour @Temperature 248 °F
Trelleborg Emerson & Cuming Eccobond® A 316 Filler End Cap Epoxy Adhesive Emerson & Cuming A 316 Eccobond® Filler End Cap Epoxy AdhesiveOne component, pourable, fast heat curing, epoxy adhesive. Exhibits excellent thermal stability and resistance to chemicals. Used as en..
Cure Time	18.0 min @Temperature 22.0 °C	0.300 hour @Temperature 71.6 °F	50% RH; Tack Free Time
Parker Chomerics CHO-FORM 5528 Conductive Form-In-Place Gaskets Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
Cure Time	18.0 min @Temperature 22.0 °C	0.300 hour @Temperature 71.6 °F	50% RH; Tack Free Time
Parker Chomerics CHO-FORM 5531 EMI Shielding Material One component, moisture cure, form-in-place EMI gasketing material. This electrically conductive formulation contains silver-plated copper particles dispersed in a silicone elastomer. It is designed..
Cure Time	18.0 min @Temperature 22.0 °C	0.300 hour @Temperature 71.6 °F	50% RH; Tack Free Time
Parker Chomerics CHO-FORM 5538 Conductive Form-In-Place Gaskets Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..