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Cotronics Resbond™ 905 High Temperature Ceramic Adhesive, Low Expansion

Category Ceramic
Manufacturer Cotronics
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cotronics Resbond™ 905 High Temperature Ceramic Adhesive, Low Expansion.pdf
Price EMAIL US    sales@lookpolymers.com
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Material Notes:
Mechanical Properties Metric English Comments
Flexural Strength 14.5 MPa
2100 psi
Compressive Strength 22.1 MPa
3200 psi
Thermal Properties Metric English Comments
CTE, linear 0.540 µm/m-°C

@Temperature 20.0 °C
0.300 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 1.44 W/m-K
10.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 1370 °C
2500 °F
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+11 ohm-cm
1.00e+11 ohm-cm
Dielectric Strength 7.87 kV/mm
200 kV/in
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