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Polymer Property : CTE, linear = 31.1 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 56.0 - 70.2 µm/m-°C | 31.1 - 39.0 µin/in-°F | Average value: 66.5 µm/m-°C Grade Count:19 |
| Overview of materials for Polycarbonate, Optical Grade This property data is a summary of similar materials in the MatWeb database for the category "Polycarbonate, Optical Grade". Each property range of values reported is minimum and maximum values of a.. |
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| CTE, linear | 56.0 µm/m-°C @Temperature 20.0 °C |
31.1 µin/in-°F @Temperature 68.0 °F |
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| Humiseal 1B12 Acrylic Conformal Coating Humiseal 1B12 Acrylic Conformal CoatingHigh moisture resistanceExcellent dielectrical propertiesSelective chemical resistanceExcellent repairabilityPasses thermal shock test (MIL-I-46058C)Flammabili.. |
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| CTE, linear | 56.0 µm/m-°C @Temperature 20.0 °C |
31.1 µin/in-°F @Temperature 68.0 °F |
DIN 53752 |
| GEHR Plastics PEI Polyetherimide Polyetherimide has a high mechanical strength in connection with a good chemical and heat resistance, good dimensional stability and creep resistance. Its unique torque strength permits the economic.. |
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| CTE, linear | 56.0 µm/m-°C @Temperature 20.0 °C |
31.1 µin/in-°F @Temperature 68.0 °F |
DIN 53752 |
| GEHR Plastics PPSU Polyphenylenesulfone Polyphenylenesulfone is an amorphous material, with improved impact and hydrolysis resistance compared to PSU. The usual operating temperature is approximately 180°C. The extremely high notched i.. |
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| CTE, linear | 56.0 µm/m-°C @Temperature 20.0 °C |
31.1 µin/in-°F @Temperature 68.0 °F |
DIN 53752 |
| GEHR Plastics PSU Polysulfone Polysulfone shows great thermal stability. It possesses a high mechanical strength, very good dielectric properties and hydrolysis resistance and a high radiation resistance. PSU has a low notch imp.. |
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| CTE, linear | 56.0 µm/m-°C | 31.1 µin/in-°F | DIN 52328 |
| Isoflon PSU Polysulfone Electrical insulating productsRigidHigh chemical, fire and temperature resistanceInformation provided by Isoflon. |
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| CTE, linear | 56.0 µm/m-°C @Temperature -30.0 - 100 °C |
31.1 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
| LyondellBasell Hifaxâ„¢ CB247G Thermoplastic Polyolefin Elastomer Description: Hifaxâ„¢ CB247G high melt flow, 1,700 MPa flexural modulus, UV-stabilized, weatherable, mineral-filled thermoplastic elastomeric olefin (TEO) resin has a very good balance of propert.. |
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| CTE, linear | 56.0 µm/m-°C | 31.1 µin/in-°F | ASTM D696 |
| Samyang Trirex® 3022A Polycarbonate TRIREX® polycarbonate resins offer superior transparency, mechanical properties, good dimensional stability and high electrical performance, which allows it to be widely used for electrical, elec.. |
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| CTE, linear | 56.0 µm/m-°C | 31.1 µin/in-°F | ASTM D696 |
| Samyang Trirex® 3022L1 Polycarbonate, Lens Grade TRIREX® polycarbonate resins offer superior transparency, mechanical properties, good dimensional stability and high electrical performance, which allows it to be widely used for electrical, elec.. |
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| CTE, linear | 56.0 µm/m-°C | 31.1 µin/in-°F | ASTM D696 |
| Samyang Trirex® 3025L1 Polycarbonate, Lens Grade TRIREX® polycarbonate resins offer superior transparency, mechanical properties, good dimensional stability and high electrical performance, which allows it to be widely used for electrical, elec.. |
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| CTE, linear | 56.0 µm/m-°C | 31.1 µin/in-°F | ASTM D696 |
| Samyang Trirex® 3027IR Polycarbonate TRIREX® polycarbonate resins offer superior transparency, mechanical properties, good dimensional stability and high electrical performance, which allows it to be widely used for electrical, elec.. |
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| CTE, linear | 56.0 µm/m-°C | 31.1 µin/in-°F | ASTM D696 |
| Samyang Trirex® 3030I Polycarbonate TRIREX® polycarbonate resins offer superior transparency, mechanical properties, good dimensional stability and high electrical performance, which allows it to be widely used for electrical, elec.. |
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| CTE, linear | 56.0 µm/m-°C | 31.1 µin/in-°F | ASTM D696 |
| Samyang Trirex® 3030IR Polycarbonate TRIREX® polycarbonate resins offer superior transparency, mechanical properties, good dimensional stability and high electrical performance, which allows it to be widely used for electrical, elec.. |
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| CTE, linear | 56.0 µm/m-°C | 31.1 µin/in-°F | ASTM D696 |
| Samyang Trirex® 3030U Polycarbonate, UV Stabilized TRIREX® polycarbonate resins offer superior transparency, mechanical properties, good dimensional stability and high electrical performance, which allows it to be widely used for electrical, elec.. |
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| CTE, linear | 56.0 µm/m-°C | 31.1 µin/in-°F | ASTM D696 |
| Samyang Trirex® 3025A Polycarbonate TRIREX® polycarbonate resins offer superior transparency, mechanical properties, good dimensional stability and high electrical performance, which allows it to be widely used for electrical, elec.. |
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| CTE, linear | 56.0 µm/m-°C @Temperature 40.0 - 130 °C |
31.1 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 3356 Phenolic, Granular, Transfer Molded PLENCO 03356 is a mineral filled phenolic molding compound offering excellent arc resistance, comparative tracking, and flame resistant properties. UL recognized under component file E40654. 03356 i.. |
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| CTE, linear | 56.0 µm/m-°C @Temperature -30.0 - 80.0 °C |
31.1 µin/in-°F @Temperature -22.0 - 176 °F |
Borealis Method |
| Borealis MS64T20 Polypropylene Compound, Mineral Filled MS64T20 is a 20% mineral filled polypropylene compound intended for injection molding. This material has excellent balanced mechanical properties and is easy to process. Applications: automotive p.. |
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| CTE, linear | 56.0 µm/m-°C @Temperature 40.0 - 130 °C |
31.1 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 4548 Phenolic, Granular, Injection Molded PLENCO 04548 is a heat resistant mineral filled phenolic molding compound, offering fast cure rates and hot rigidity. Type ASTM 5948 CFG, and UL recognized under component file E40654. 04548 is avai.. |
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| CTE, linear | 56.0 µm/m-°C @Temperature 20.0 °C |
31.1 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Covestro Bayflex® XGT-80 Polyurethane Elastomeric RIM, 15% Milled Glass Filled, MDI-based 2-Component Liquid System 0.125 in. thickness. RIM = Reaction Injection MoldingInformation provided by Bayer Corporation, Polyurethanes DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and of.. |
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| CTE, linear | 56.0 µm/m-°C | 31.1 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® 301-2FL Low Stress, Optical Epoxy Product Description: EPO-TEK® 301-2FL is a two component optical, medical, and semiconductor grade epoxy resin. It is a more flexible version of EPO-TEK® 301-2.Advantages & Application Notes: Sug.. |
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| CTE, linear | 56.0 µm/m-°C | 31.1 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® 302-3M Optically Transparent Epoxy Product Description: EPO-TEK® 302-3M is a two component epoxy used for optical, medical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as.. |
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| CTE, linear | 56.0 µm/m-°C | 31.1 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® 337H Graphite-Filled, High Temperature Epoxy Product Description: EPO-TEK® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic ind.. |
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| CTE, linear | 56.0 µm/m-°C | 31.1 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® H20-FC Electrically Conductive Epoxy Product Description: EPO-TEK®H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly.Adv.. |
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| CTE, linear | 56.0 µm/m-°C | 31.1 µin/in-°F | |
| Epoxyset Epoxiohm EO-38M-3 Electrically Conductive Epoxy Adhesive EO-38M-3 is a two components, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is used for thermal management appl.. |
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| CTE, linear | 56.0 µm/m-°C | 31.1 µin/in-°F | |
| Epoxyset Epoxiohm EO-97M Electrically Conductive Epoxy Adhesive EPOXIOHM-97M is one part, pure silver filled, high electrical conductivity, epoxy adhesive. It is designed for microelectronics chip bonding application.Information provided by Epoxyset Inc. |
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| CTE, linear | 56.0 µm/m-°C | 31.1 µin/in-°F | above Tg |
| Gromax Evasin EV-3201V Ethylene-Vinyl Alcohol Copolymer Unmodified random Co-Polymer of [Ethylene-Vinyl alcohol], designed for therm-plastic processing into Sheets and Foils with high Oxygen and Aroma Barrier EffectInformation provided by Gromax Enterpri.. |
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| CTE, linear | 56.0 µm/m-°C | 31.1 µin/in-°F | ASTM D696 |
| Samyang Trirex® TH3022N Polycarbonate, High Flow Flame Retardancy PC is characterized by its excellent impact resistance, dimensional stability and excellent thermal resistance.TH3022N is a high flow, flame retardant grade.Applications: LCD TV, Laptop and Monitor.. |
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