Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. Also available in a single component frozen syringe.Advantages & Application Notes: Designed specifically to meet the requirements pertaining to MIL-STD 883/Test Method 5011 for military hybrids.Processing info: It can be applied by many dispensing, stamping and screen printing techniques.Dispensing: compatible with pressure/time delivery, auger screws, fluid jetting and G27 needles, in a single-component fashion.Screen Printing: best using >200 metal mesh, with polymer squeegee blade with 80D hardness.Stamping: small dots 6 mil in diameter can be realized.Misc / Other notesMany technical papers written over 30-40 year lifetime.Over 1 trillion chips attached at a single company: no failures, Six Sigma and Certified Parts Supplier award winner.Versatility in curing techniques including box oven, SMT style tunnel oven, heater gun, hot plate, IR, convection, or inductor coil.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	2.03 g/cc	2.03 g/cc	Part A
	3.07 g/cc	3.07 g/cc	Part B
Particle Size	<= 45 µm	<= 45 µm
Viscosity	2200 - 3200 cP @Temperature 23.0 °C	2200 - 3200 cP @Temperature 73.4 °F	100 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	75	75
Tensile Modulus	5.576 GPa	808.7 ksi	Storage
Shear Strength	10.17 MPa	1475 psi	Lap
	>= 11.7 MPa	>= 1700 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	31.0 µm/m-°C	17.2 µin/in-°F	Below Tg
	158 µm/m-°C	87.8 µin/in-°F	Above Tg
Thermal Conductivity	2.50 W/m-K	17.4 BTU-in/hr-ft²-°F	Based on standard method: Laser Flash
	29.0 W/m-K	201 BTU-in/hr-ft²-°F	Based on Thermal Resistance Data: R = L x K<sup>-1</sup>x A<sup>-1</sup>
Maximum Service Temperature, Air	200 °C	392 °F	Continuous
	300 °C	572 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 80.0 °C	>= 176 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature	425 °C	797 °F	Degradation Temperature

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.00040 ohm-cm	<= 0.00040 ohm-cm

Chemical Properties	Metric	English
Ionic Impurities - Na (Sodium)	<= 50 ppm	<= 50 ppm
Ionic Impurities - K (Potassium)	<= 50 ppm	<= 50 ppm
Ionic Impurities - Cl (Chloride)	<= 200 ppm	<= 200 ppm

Processing Properties	Metric	English	Comments
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F	Minimum Bond Line
Pot Life	2880 min	2880 min
Shelf Life	6.00 Month @Temperature 25.0 °C	6.00 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Silver	Part A
	Silver	Part B
Consistency	Smooth paste
Ionic Impurities NH4	126 ppm
Mix Ratio By Weight	1:1
Number of Components	Two
Thixotropic Index	4.63
Weight Loss	0.59%	200°C
	1.09%	250°C
	1.67%	300°C

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