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Rogers Corporation RO4003C Glass-Reinforced Hydrocarbon and Ceramic Laminate with Thin Film Resistor Foil

Category Ceramic , Ceramic Matrix Composite
Manufacturer Rogers Corporation
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Rogers Corporation RO4003C Glass-Reinforced Hydrocarbon and Ceramic Laminate with Thin Film Resistor Foil.pdf
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Material Notes:
RO4000® Series High Frequency Circuit Materials are glass-reinforced hydrocarbon and ceramic (not PTFE) laminates with TICER™ TCR® Thin Film Resistor Foils. These laminates are designed for performance sensitive, high volume commercial applications. RO4000 laminates are designed to offer superior high frequency performance and low-cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR4) processes.Features and Benefits:Glass-reinforced hydrocarbon and ceramic dielectricVolume manufacturing processExcellent high-frequency performanceLow Z-axis expansion, excellent dimensional stabilityIntegrated thin film resistor benefitsFoils available in 25, 50 and 100 OPS NiCrFoils offered in 1/2 ounce copper weightLead-Free process compatibleTypical Applications:Global communications systemsHigh reliability and complex multilayer circuitsWireless communication devicesInformation provided by Rogers Corporation.
Physical Properties Metric English Comments
Density 1.79 g/cc
0.0647 lb/in³
ASTM D792
Moisture Absorption at Equilibrium 0.060 %

@Temperature 50.0 °C,
Time 173000 sec
0.060 %

@Temperature 122 °F,
Time 48.0 hour
Immersion; 0.06 in thick; ASTM D570
Thickness 203 - 1520 microns
8.00 - 60.0 mil
Range of Thicknesses Available
Mechanical Properties Metric English Comments
Tensile Strength 141 MPa
20400 psi
RT, Y direction; ASTM D638
Tensile Modulus 26.9 GPa
3900 ksi
RT, Y direction; ASTM D638
Flexural Strength 276 MPa
40000 psi
IPC-TM-650, 2.4.4
Peel Strength 1.05 kN/m
6.00 pli
Copper, After Solder Float, 1/2 ounce TCR Foil; IPC-TM-650 2.4.8
Thermal Properties Metric English Comments
CTE, linear 11.0 µm/m-°C

@Temperature -55.0 - 288 °C
6.11 µin/in-°F

@Temperature -67.0 - 550 °F
X-Direction; IPC-TM-650 2.4.41
14.0 µm/m-°C

@Temperature -55.0 - 288 °C
7.78 µin/in-°F

@Temperature -67.0 - 550 °F
Y-Direction; IPC-TM-650 2.4.41
46.0 µm/m-°C

@Temperature -55.0 - 288 °C
25.6 µin/in-°F

@Temperature -67.0 - 550 °F
Z-Direction; IPC-TM-650 2.4.41
Thermal Conductivity 0.710 W/m-K

@Temperature 80.0 °C
4.93 BTU-in/hr-ft²-°F

@Temperature 176 °F
ASTM C518
Glass Transition Temp, Tg >= 280 °C
>= 536 °F
Condition A; IPC-TM-650 2.4.24
Decomposition Temperature 425 °C
797 °F
TGA; ASTM D3850
Electrical Properties Metric English Comments
Volume Resistivity 1.70e+16 ohm-cm
1.70e+16 ohm-cm
Cond. A; IPC 2.5.17.1
Surface Resistance 4.20e+15 ohm
4.20e+15 ohm
Cond. A; IPC 2.5.17.1
Dielectric Constant 3.55
3.55
Design Spec., FSR, Z-direction; IPC-TM-650 2.5.5.6
3.33 - 3.43

@Frequency 1.00e+10 Hz
3.33 - 3.43

@Frequency 1.00e+10 Hz
Process, Clamped stripline, Z-direction; IPC-TM-650 2.5.5.5
Dielectric Strength 30.7 kV/mm

@Thickness 0.510 mm
780 kV/in

@Thickness 0.0201 in
Z Direction; IPC-TM-650 2.5.6.2
Dissipation Factor 0.0021

@Frequency 2.50e+9 Hz
0.0021

@Frequency 2.50e+9 Hz
IPC-TM-650 2.5.5.5
0.0027

@Frequency 1.00e+10 Hz
0.0027

@Frequency 1.00e+10 Hz
IPC-TM-650 2.5.5.5
Descriptive Properties Value Comments
Dimensional Stability < 0.3 mm/m
X, Y direction; IPC-TM-650, 2.4.39A; after etch; +E2/150°C
Thermal Coefficient of Dielectric Constant 40 ppm/°C
IPC-TM-650 2.5.5.5; -50°C to 150°C; Z-Direction
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