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Polymer Property : Deflection Temperature at 1.8 MPa (264 psi) = 194 °C Product List

Thermal Properties

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Thermal Properties Metric English Comments
Deflection Temperature at 1.8 MPa (264 psi) 194 - 256 °C
381 - 493 °F
Average value: 232 °C Grade Count:7
Overview of materials for Polycyclohexylenedimethylene Terephthalate (PCT), 20% Glass Reinforced
This property data is a summary of similar materials in the MatWeb database for the category "PCT or PCTA, 20% Glass Reinforced". Each property range of values reported is minimum and maximum values..
Deflection Temperature at 1.8 MPa (264 psi) 194 °C
381 °F
Flatw 80*10*4 sp=64mm; ISO 75/Af
SABIC Innovative Plastics LNP LUBRICOMP ICL34 PA6.12
LNP* LUBRICOMP* ICL34 is a compound based on Nylon 6/12 containing 20% Carbon Fiber, 15% PTFE. Added features include: Wear Resistant.
Deflection Temperature at 1.8 MPa (264 psi) 194 °C
381 °F
Flatw 80*10*4 sp=64mm; ISO 75/Af
SABIC Innovative Plastics LNP STAT-KON WE003ER PBT (Europe-Africa-Middle East)
LNP* Stat-kon* WE003ER is a compound based on Polybutylene Terephalate resin containing Carbon Fiber. Added features of this material include: Easy Molding, Easy Release, Electrically Conductive.
Deflection Temperature at 1.8 MPa (264 psi) 194 °C

@Thickness 3.20 mm
381 °F

@Thickness 0.126 in
unannealed; ASTM D648
SABIC Innovative Plastics LNP STAT-KON ZX08301 PPE (Asia Pacific)
Stat-Kon* ZX08301 compound is a high heat compounds with ESD safe and low warpage performance suitable for use in Semiconductor Packaging Applications.
Deflection Temperature at 1.8 MPa (264 psi) 194 °C
381 °F
Flatw 80*10*4 sp=64mm; ISO 75/Af
SABIC Innovative Plastics LNP THERMOCOMP EX06430H PEI
LNP* THERMOCOMP* EX06430H is a compound based on Polyetherimide resin containing Proprietary Filler(s). Added feature of this grade is: Healthcare.
Deflection Temperature at 1.8 MPa (264 psi) 194 °C

@Thickness 6.40 mm
381 °F

@Thickness 0.252 in
ASTM D648
Samsung Cheil Industries Infino® VB-5150GL PBT, 15% Glass Filled FR
Information provided by Samsung Cheil Industries.
Deflection Temperature at 1.8 MPa (264 psi) 194 °C

@Thickness 3.20 mm
381 °F

@Thickness 0.126 in
unannealed; ASTM D 648
SABIC Innovative Plastics LNP Thermocomp OF003A PPS
LNP* Thermocomp* OF003A is a compound based on Polyphenylene Sulfide resin containing Glass Fiber.This data was supplied by SABIC-IP for the Americas region.
Deflection Temperature at 1.8 MPa (264 psi) 194 °C
381 °F
Flatw 80*10*4 sp=64mm; ISO 75/Af
SABIC Innovative Plastics LNP THERMOCOMP QF0069 PA6.10 (Europe-Africa-Middle East)
LNP* THERMOCOMP* QF0069 is a compound based on PA610 resin contaning Glass Fiber, Flame Retardant. Added features include: Flame retardant.
Deflection Temperature at 1.8 MPa (264 psi) 194 °C

@Thickness 3.20 mm
381 °F

@Thickness 0.126 in
unannealed; ASTM D648
SABIC Innovative Plastics LNP THERMOCOMP WF0039U PBT
LNP* THERMOCOMP* WF0039U is a compound based on PBT resin containing 15% Glass Fiber. Added features of this grade include: Flame Retardant and UV Stabilized.
Deflection Temperature at 1.8 MPa (264 psi) 194 °C

@Thickness 3.20 mm
381 °F

@Thickness 0.126 in
unannealed; ASTM D 648
SABIC Innovative Plastics LNP Thermocomp OF003A PPS (Asia Pacific)
LNP* Thermocomp* OF003A is a compound based on Polyphenylene Sulfide resin containing Glass Fiber.This data was supplied by SABIC-IP for the Asia Pacific region.
Deflection Temperature at 1.8 MPa (264 psi) 194 °C

@Thickness 6.40 mm
381 °F

@Thickness 0.252 in
ASTM D648
Samsung Cheil Industries Infino® VB-5150GL PBT, 15% Glass Filled FR
Information provided by Samsung Cheil Industries.
Deflection Temperature at 1.8 MPa (264 psi) 194 °C
381 °F
ASTM D648
Plenco 00714 Melamine-Phenolic, Granular, Compression Molded
PLENCO 00714 is a melamine-phenolic copolymer molding compound, offering excellent arc resistance and comparative track index values. Type ASTM D 5948 CMG, and UL recognized under component file E4..
Deflection Temperature at 1.8 MPa (264 psi) 194 °C
381 °F
ASTM D648
Plenco 2369 Phenolic, Granular, Compression Molded
PLENCO 02369 is a general purpose, organic filled phenolic molding compound, formulated to minimize the generation of free ammonia for applications that are sensitive to such formation. PLENCO 02369..
Deflection Temperature at 1.8 MPa (264 psi) 194 °C
381 °F
ASTM D648
Plenco 3509 Phenolic, Granular, Compression Molded
PLENCO 03509 is a mineral and flock filled phenolic molding compound offering excellent electrical properties, dimensional stability, and improved heat resistance. UL recognized under component file..
Deflection Temperature at 1.8 MPa (264 psi) 194 °C
381 °F
ASTM D648
Plenco 4300 Phenolic, Granular, Transfer Molded
PLENCO 04300 is a heat resistant, mineral filled phenolic molding compound offering optimum cure characteristics and excellent dimensional stability. It is formulated for wiring devices and electric..
Deflection Temperature at 1.8 MPa (264 psi) 194 °C
381 °F
dry; ISO 75-1/-2
DSM Novamid® 1013G15 1 NA PA6-GF15
15% Glass Reinforced, Injection Molding
Deflection Temperature at 1.8 MPa (264 psi) 194 °C
381 °F
dry; ISO 75-1/-2
DSM Novamid® 1013GH15 1 NA/BK37 PA6-GF15
15% Glass Reinforced, Heat Stabilized, Injection Molding
Deflection Temperature at 1.8 MPa (264 psi) 194 °C
381 °F
ASTM D648
A. Schulman ComAlloy Lubrilon® 628 Nylon 6/6, Glass Fiber/Molybdenum Disulfide Filled, Flow Enhanced
Data provided by the manufacturer, ComAlloy International Company. High performance and excellent lubricity with minimal surface wear.The ComAlloy product line has been integrated into the A Schulma..
Deflection Temperature at 1.8 MPa (264 psi) 194 - 260 °C
381 - 500 °F
Average value: 246 °C Grade Count:35
Overview of materials for Nylon 66, Glass Fiber/MoS2 Filled
This property data is a summary of similar materials in the MatWeb database for the category "Nylon 66, Glass Fiber/MoS2 Filled". Each property range of values reported is minimum and maximum values..
Deflection Temperature at 1.8 MPa (264 psi) 194 °C
381 °F
ASTM D648
Plenco 6527 Phenolic, Granular, Injection Molded
PLENCO 06527 is a woodflour and mineral filled resole phenolic molding compound.Information supplied by Plenco.
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