Polymer Property : CTE, linear = 26.1 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	47.0 µm/m-°C @Temperature 0.000 - 100 °C	26.1 µin/in-°F @Temperature 32.0 - 212 °F	X-Direction; 5°C/min; ASTM D3386
Rogers Corporation RT/duroid® 6006 Ceramic-PTFE Composite Microwave Laminate Features:High dielectric constant for circuit size reductionLow loss - Ideal for operating at X-band or belowTight dielectric constant and thickness control for repeatable circuit performanceLow moi..
CTE, linear	47.0 µm/m-°C @Temperature 0.000 - 100 °C	26.1 µin/in-°F @Temperature 32.0 - 212 °F	Z-Direction; 5°C/min; ASTM D3386
Rogers Corporation RT/duroid® 6010.2LM Ceramic-PTFE Composite Microwave Laminate Features:High dielectric constant for circuit size reductionLow loss - Ideal for operating at X-band or belowLow Z-axis expansion. Provides reliable plated through holes in multi-layer boardsTight ..
CTE, linear	47.0 µm/m-°C @Temperature <=100 °C	26.1 µin/in-°F @Temperature <=212 °F	ISO E 830
Wolf Kunststoff ZEDEX® ZX-324V1T A3H PEEK Polymer, Reinforced Main Characteristics: High resilience; High elasticity; Low permanent deformation; Stress resistant; High strength at temperatures above 140 ° CApplications: Shipbuilding; Chemical Engineering; Aut..
CTE, linear	47.0 µm/m-°C @Temperature <=150 °C	26.1 µin/in-°F @Temperature <=302 °F	ISO E 831
Wolf Kunststoff ZEDEX® ZX-750V5T A9T Polymer Alloy Main Characteristics: Hard; Stiff; Tough; High dimensional stability; High fatigue strength; High weather resistance; Good fire behavior; Suitable for vacuum; Good machinability; Contains PTFE; Stre..
CTE, linear	47.0 µm/m-°C @Temperature 10.0 - 50.0 °C	26.1 µin/in-°F @Temperature 50.0 - 122 °F	Alpha 1
Tra-Con Tra-Bond 526M05 Rapid Low Temperature Cure Adhesive TRA-BOND 526M05 is a low viscosity, fast cure at low temperature, long pot-life adhesive. Information provided by Tra-Con Inc.
CTE, linear	47.0 µm/m-°C @Temperature 200 - 300 °C	26.1 µin/in-°F @Temperature 392 - 572 °F	DIN 53 752
Ensinger TECASINT 4051 Polyimide, Beige, 30% Glass Fiber (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel..
CTE, linear	47.0 µm/m-°C @Temperature 50.0 - 200 °C	26.1 µin/in-°F @Temperature 122 - 392 °F	DIN 53 752
Ensinger TECASINT™ 2021 Polyimide, Brown (PI) TECASINT™ 2000 series of polyimide stock shapes provide a superior combination of high temperature and bearing and wear, properties that make it an ideal choice for the most demanding applications...