Polymer Property : Glass Transition Temp, Tg = 140 °F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Glass Transition Temp, Tg	60.0 °C	140 °F	DMA, E"
Proto3000 Accura® 25 Plastic Stereolithography (SLA) Prototyping Polymer Description: A high stiffness engineered nanocomposite that opens new applications for stereolithography users. Features: Look and feel of molded polypropyleneOutstanding feature resolution and accu..
Glass Transition Temp, Tg	60.0 °C	140 °F	TM R050-25
Resinlab® EP965LVLX Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has ..
Glass Transition Temp, Tg	60.0 °C	140 °F
Unitika elitel UE3203 Polyester, Pellet High elongation type UE3200UNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as adhesives, paints, ink binders,..
Glass Transition Temp, Tg	60.0 °C	140 °F
Unitika elitel UE3380 Polyester, Flake Low molecular weight type UE3200, Low softening point, High OH typeUNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products..
Glass Transition Temp, Tg	60.0 °C	140 °F	Ultimate Tg
Tra-Con Tra-Duct 916H01 Electronically Conductive Silver-Filled Epoxy TRA-DUCT 916H01 is an electronically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical ..
Glass Transition Temp, Tg	60.0 °C	140 °F
Epoxyset Epoxibond EB-103F Unfilled Epoxy Adhesive A two-component, unfilled, fast setting epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries. EB-103F has excellent bond strength to v..
Glass Transition Temp, Tg	60.0 °C	140 °F	DAM; 10°C/min; ISO 11357-1/-2
DuPont Performance Polymers Zytel® 103FHS NC010 Nylon 66 (Unverified Data**) Unreinforced Heat Stabilized Polyamide 66 Zytel 103FHS NC010 is a heat stabilized internally lubricated polyamide 66 resin for injection molding. It was developed for fast cycles and high productivi..
Glass Transition Temp, Tg	60.0 °C	140 °F
Armstrong A-271 Epoxy Adhesive A clear amber adhesive system. A-271 is a medium viscosity liquid with excellent wetting ability. It is ideal for bonding glass or similar smooth surfaces. It features very low shrinkage coupled ..
Glass Transition Temp, Tg	60.0 °C	140 °F
3M Scotch-Weld™ DP805 Acrylic Adhesives 3M™ Scotch-Weld™ Acrylic Adhesive DP805 is a two-part, 1:1 mix ratio, toughened acrylic structural adhesives. They exhibit excellent shear and peel strengths along with good impact and durability ..
Glass Transition Temp, Tg	60.0 °C	140 °F	DAM; 10°C/min; ISO 11357-1/-2
DuPont Performance Polymers Zytel® 101 NC010 Nylon 66 (Unverified Data**) Unreinforced Polyamide 66Zytel 101 NC010 is a general purpose polyamide 66 resin for injection molding and extrusion.Information provided by DuPont Performance Polymers
Glass Transition Temp, Tg	60.0 °C	140 °F
Loctite® Durabond® E-20HP Epoxy Adhesive Epoxy AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 appli..
Glass Transition Temp, Tg	60.0 - 170 °C	140 - 338 °F	Average value: 97.6 °C Grade Count:12
Overview of materials for Epoxy, Molded, Glass Fiber Filler This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Molded, Glass Fiber Filler". Each property range of values reported is minimum and maximum values..
Glass Transition Temp, Tg	60.0 °C	140 °F	DAM; 10°C/min; ISO 11357-1/-2
DuPont Performance Polymers Zytel® RS 3261THSL BK041A Nylon 610 (Unverified Data**) Toughened Renewably Sourced Polyamide 610 Developed for Injection Molding Zytel RS 3261THSL BK041A is a renewably sourced polyamide 610 resin containing a minimum of 47% renewably sourced ingredient..
Glass Transition Temp, Tg	60.0 °C	140 °F	TM R050-25
Resinlab® EP1046FG Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1046FG Clear is a two part unfilled very fast curing electronic grade epoxy encapsulant designed for small castings (less than 25 grams). It cures very quickly with low exotherm to a to..