Polymer Property : Tensile Modulus = 2.26 GPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Tensile Modulus	2.26 GPa	328 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® 4504 PPC High heat resistant polycarbonate copolymer, provides DTUL of 290F at 264 psi. FDA food contact compliant in limited colors. Effective January 15th, 2008 this grade will no longer be supported with ..
Tensile Modulus	2.26 GPa	328 ksi	50 mm/min; ASTM D638
SABIC Innovative Plastics Lexan® EXL1132T PC Copolymer Lexan* EXL1132T polycarbonate (PC) siloxane copolymer resin is a UV stabilized transparent injection molding (IM) grade with extra release properties. This resin offers good low temperature (-20 C) ..
Tensile Modulus	2.26 GPa	328 ksi	50 mm/min; ASTM D638
SABIC Innovative Plastics Lexan® EXL1132T PC Copolymer (Europe-Africa-Middle East) Lexan* EXL1132T polycarbonate (PC) siloxane copolymer resin is a UV stabilized transparent injection molding (IM) grade with extra release properties. This resin offers good low temperature (-20 C) ..
Tensile Modulus	2.26 GPa	328 ksi	50 mm/min; ASTM D 638
SABIC Innovative Plastics Lexan® EXL1192T PC Copolymer Lexan* EXL1192T polycarbonate (PC) siloxane copolymer resin is a transparent injection molding (IM) grade with extra release properties for food contact applications. This resin offers good low temp..
Tensile Modulus	2.26 GPa	328 ksi	50 mm/min; ASTM D638
SABIC Innovative Plastics Lexan® EXL9112 PC Copolymer Opaque PC-Siloxane copolymer with excellent processability. Improved flow, low temp. ductility. Non-chlorinated, non-brominated flame retardant product. UL rated V-0/5VA.
Tensile Modulus	2.26 GPa	328 ksi	50 mm/min; ASTM D638
SABIC Innovative Plastics Lexan® FXD941A PC (Europe-Africa-Middle East) Transparent/translucent PC for light diffusion special effects. Color package may affect performance.
Tensile Modulus	2.26 GPa	328 ksi	50 mm/min; ASTM D638
SABIC Innovative Plastics Lexan® FXM1413T PC Copolymer PC-siloxane copolymer in special metallic colors. Medium flow. Improved toughness compared to medium flow standard PC in same color. Color package may affect performance.
Tensile Modulus	2.26 GPa	328 ksi	50 mm/min; ASTM D638
SABIC Innovative Plastics Lexan® FXM1413T PC Copolymer (Asia Pacific) PC-siloxane copolymer in special metallic colors. Medium flow. Improved toughness compared to medium flow standard PC in same color. Color package may affect performance.
Tensile Modulus	2.26 GPa	328 ksi	50 mm/min; ASTM D638
SABIC Innovative Plastics Lexan® FXM1414T PC Copolymer PC-siloxane copolymer in special metallic colors. Medium flow. Improved toughness compared to medium flow standard PC in same color. Color package may affect performance.
Tensile Modulus	2.26 GPa	328 ksi	50 mm/min; ASTM D 638
SABIC Innovative Plastics Lexan® FXM1414T PC Copolymer (Europe-Africa-Middle East) PC-siloxane copolymer in special metallic colors. Medium flow. Improved toughness compared to medium flow standard PC in same color. Color package may affect performance.This data was supplied by ..
Tensile Modulus	2.26 GPa	328 ksi	5 mm/min; ASTM D638
SABIC Innovative Plastics Lexan® HFD1014 PC Copolymer (Europe-Africa-Middle East) 7 MFR LEXAN HFD Copolymer
Tensile Modulus	2.26 GPa	328 ksi	5 mm/min; ASTM D638
SABIC Innovative Plastics Lexan® HFD1034 PC Copolymer 7 MFR LEXAN HFD Copolymer UV-stabilized, available in transparent colors only
Tensile Modulus	2.26 GPa	328 ksi	5 mm/min; ASTM D638
SABIC Innovative Plastics Lexan® HFD1034 PC Copolymer (Europe-Africa-Middle East) 7 MFR LEXAN HFD Copolymer UV-stabilized, available in transparent colors only
Tensile Modulus	2.26 GPa	328 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® HPH4504 PPC (Asia Pacific) High heat specialty polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 of USP Class VI). EtO, steam, gamma and e-beam steril..
Tensile Modulus	2.26 GPa	328 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® HPH4504 PPC (Europe-Africa-Middle East) High heat specialty polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 of USP Class VI). EtO, steam, gamma and e-beam steril..
Tensile Modulus	2.26 GPa	328 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® HPH4504H PPC (Europe-Africa-Middle East) High heat specialty polycarbonate with enhanced autoclavability. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 of USP Class VI). EtO, ..
Tensile Modulus	2.26 GPa	328 ksi	50 mm/min; ASTM D638
SABIC Innovative Plastics Lexan® EXL9132 PC Copolymer (Asia Pacific) Opaque PC-Siloxane copolymer with excellent processability. Improved flow, low temperature ductility, UV stabilized. Non-chlorinated, non-brominated flame retardant product. UL rated V0/5VA.
Tensile Modulus	2.26 GPa	328 ksi	50 mm/min; ASTM D638
SABIC Innovative Plastics Lexan® EXL9132 PC Copolymer (Europe-Africa-Middle East) Opaque PC-Siloxane copolymer with excellent processability. Improved flow, low temperature ductility, UV stabilized. Non-chlorinated, non-brominated flame retardant product. UL rated V0/5VA.
Tensile Modulus	2.26 GPa	328 ksi	5 mm/min; ASTM D 638
SABIC Innovative Plastics Lexan® EXRL0684 PC Copolymer 7 MFR LEXAN High Flow Ductile CopolymerThis data was supplied by SABIC-IP for the Americas region.
Tensile Modulus	2.26 GPa @Thickness 3.20 mm	327 ksi @Thickness 0.126 in	1 mm/min; ASTM D638
LG Chemical AF360C ABS, TBBA-free Flame Retardant, High Flow Feature: Injection Molding, TBBA-free Flame Retardant, High FlowApplication: Electric/Electronic Applications (TV, Monitor Housing) IT/OA deviceCAS No. 9003-56-9 and 1309-64-4Information provided by..
Tensile Modulus	2.26 GPa	327 ksi	5 mm/min; ASTM D638
Samsung Cheil Industries InfinoÂ® EF-1032 PC/ABS, Unreinforced FR Extrusion resin, non-halogen flame-retardantInformation provided by Samsung Cheil Industries.
Tensile Modulus	2.26 GPa	327 ksi	50 mm/min; ASTM D638
Samsung Cheil Industries InfinoÂ® NE-1050 PC/ABS, Unreinforced FR Information provided by Samsung Cheil Industries.
Tensile Modulus	2.26 GPa	327 ksi	5 mm/min; ASTM D638
Samsung Cheil Industries StarexÂ® HF-0690M ABS, Unreinforced Information provided by Samsung Cheil Industries.
Tensile Modulus	2.26 GPa	327 ksi	5 mm/min; ASTM D638
Samsung Cheil Industries StarexÂ® LX-0970 MS ABS, Unreinforced Metallic-Look Luminous Grade - gives aesthetics of a painted surface without painting. Reduces time, cost, and environmental hazards (such as soilvents).Information provided by Samsung Cheil Industries.
Tensile Modulus	2.26 GPa	327 ksi	50 mm/min; ASTM D638
Samsung Cheil Industries InfinoÂ® NE-1050 PC/ABS, Unreinforced FR Information provided by Samsung Cheil Industries.
Tensile Modulus	2.26 GPa	327 ksi	5 mm/min; ASTM D638
Samsung Cheil Industries StarexÂ® AS-0151 ABS, Unreinforced Anti-staticInformation provided by Samsung Cheil Industries.
Tensile Modulus	2.26 GPa	327 ksi	5 mm/min; ASTM D638
Samsung Cheil Industries StarexÂ® LX-0970 MS ABS, Unreinforced Metallic-Look Luminous Grade - gives aesthetics of a painted surface without painting. Reduces time, cost, and environmental hazards (such as soilvents).Information provided by Samsung Cheil Industries.
Tensile Modulus	2.26 GPa	327 ksi	50 mm/min; ASTM D638
Samsung Cheil Industries StarexÂ® LX-0981 ABS, Unreinforced Metallic-Look Luminous Grade - gives aesthetics of a painted surface without painting. Reduces time, cost, and environmental hazards (such as soilvents).Information provided by Samsung Cheil Industries.
Tensile Modulus	2.26 GPa	327 ksi	Storage
Epoxy Technology EPO-TEK® 301 Spectrally Transparent Epoxy Product Description: EPO-TEK® 301 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties.Advantages & Application Notes: Semicon..
Tensile Modulus	2.26 GPa	328 ksi	Storage
Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic indust..