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Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy

Category Polymer , Thermoset , Epoxy
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic industries such as consumer, military, medical and optical/OEM. Advantages & Application Notes:Low viscosity resin allows for ease of pouring and potting into cavities with minimal void formation.Special care should be used when mixing large masses.Opaque black while maintaining its high insulation propertiesAlso, available in a thixotropic version called EPO-TEK® 509EBT-M1. Compatible with dispensing, pouring and spin coating applicationsSuggested Applications:Optics: cutting of IR and VIS light in range of 300 to 2000 nm.Electronics; potting cables and wires into connectors, electrically isolating pins of connectors Semiconductor: a glob top over IC’s using the COB packaging formatInformation Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.01 g/cc
1.01 g/cc
Part B
1.16 g/cc
1.16 g/cc
Part A
Viscosity 400 - 1000 cP

@Temperature 23.0 °C
400 - 1000 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 85
85
Tensile Modulus 2.26 GPa
328 ksi
Storage
Shear Strength 11.75 MPa
1704 psi
Lap
>= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
Below Tg
191 µm/m-°C
106 µin/in-°F
Above Tg
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 40.0 °C
>= 104 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 365 °C
689 °F
Degradation Temperature
Optical Properties Metric English Comments
Transmission, Visible <= 5.0 %

@Wavelength 400 - 2500 nm
<= 5.0 %

@Wavelength 400 - 2500 nm
Spectral
Electrical Properties Metric English Comments
Volume Resistivity <= 3.00e+13 ohm-cm
<= 3.00e+13 ohm-cm
Dielectric Constant 3.65

@Frequency 1000 Hz
3.65

@Frequency 1000 Hz
Dissipation Factor 0.0070

@Frequency 1000 Hz
0.0070

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 120 min

@Temperature 60.0 °C
2.00 hour

@Temperature 140 °F
Minimum Bond Line
1440 min

@Temperature 23.0 °C
24.0 hour

@Temperature 73.4 °F
Minimum Bond Line
Pot Life 20 min
20 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Amber
Part B
Black
Part A
Consistency Pourable liquid
Mix Ratio By Weight 100:65
Number of Components Two
Weight Loss 0.29%
200°C
1.14%
250°C
3.47%
300°C
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