Polymer Property : Viscosity = 32000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	28000 - 32000 cP @Temperature 25.0 °C	28000 - 32000 cP @Temperature 77.0 °F	Uncured
Permabond TA430 Acrylic Adhesive & Initiator PERMABOND TA430 is a structural acrylic adhesive designed primarily for bonding metals, ferrites, ceramics, wood, and some thermoplastics. This adhesive may be used in a variety of structural bondin..
Viscosity	28000 - 32000 cP @Temperature 25.0 °C	28000 - 32000 cP @Temperature 77.0 °F	Uncured
Permabond TA4246 Toughened Acrylic Adhesive PERMABOND® TA4246 is a 2-part, no-mix, room temperature curing structural adhesive. It is ideal for use on a wide variety of substrate materials and forms a very high strength structural bond with ..
Viscosity	28000 - 32000 cP @Shear Rate 50.0 1/s, Temperature 25.0 Â°C	28000 - 32000 cP @Shear Rate 50.0 1/s, Temperature 77.0 Â°F	Haake VT 550 PK1.1Â°
Gwent Electronic Materials C2100419D1 Copper Paste This product has been designed as a copper ink for use in termination and circuit printing on ceramic substrates. This product contains a glass frit so may not be suitable for internal electrodes. ..
Viscosity	15000 - 32000 cP @Temperature 23.0 °C	15000 - 32000 cP @Temperature 73.4 °F	10 rpm
Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..