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Gwent Electronic Materials C2100419D1 Copper Paste

Category Fluid , Metal , Other Engineering Material , Ceramic/Metallic Coating
Manufacturer Gwent Electronic Materials Ltd.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Gwent Electronic Materials C2100419D1 Copper Paste.pdf
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Material Notes:
This product has been designed as a copper ink for use in termination and circuit printing on ceramic substrates. This product contains a glass frit so may not be suitable for internal electrodes. This product is in a ready to use form at a viscosity suitable for automatic or semi-automatic screen printing.Economical, lead-free formulation for ceramic applicationsScreen Printing Equipment: semi-automatic, manualScreen Types: stainless steel, polyester, mesh 200-230 tpiSubstrate: Ceramic, Barium Titanate, aluminaInformation provided by Gwent Electronic Materials Ltd.
Physical Properties Metric English Comments
Solids Content 74 - 76 %

@Temperature 700 °C
74 - 76 %

@Temperature 1290 °F
in N<sub>2</sub>
Viscosity 28000 - 32000 cP

@Shear Rate 50.0 1/s,
Temperature 25.0 °C
28000 - 32000 cP

@Shear Rate 50.0 1/s,
Temperature 77.0 °F
Haake VT 550 PK1.1°
Storage Temperature 20.0 °C
68.0 °F
sealed container
Electrical Properties Metric English Comments
Surface Resistivity per Square 0.0090 ohm
0.0090 ohm
printed through 230 ss mesh with 13 µm emulsion
Processing Properties Metric English Comments
Sintering Temperature >= 850 °C
>= 1560 °F
non-oxygen and reducing atmosphere
Cure Time 10.0 min

@Temperature 150 °C
0.167 hour

@Temperature 302 °F
Shelf Life 6.00 Month
6.00 Month
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