Physical Properties | Metric | English | Comments |
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Particle Size | <= 50 µm | <= 50 µm | 90% smaller than |
Nyco M15 WOLLASTOCOAT® Wollastonite Wollastonite is a naturally occurring white mineral with an acicular (needle-shaped) particle structure. This distinctive particle morphology makes wollastonite an ideal performance mineral for a br.. |
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Particle Size | 50 µm | 50 µm | mean value |
Potters Industries Q-Cel® 6048 Performance Benefits: A low-density, performance-enhancing additive.Fewer defects: excellent mold flow, uniform dispersionReduced compound density and viscosityIncreased acoustic and thermal insulat.. |
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Particle Size | 50 - 200 µm | 50 - 200 µm | spherical sizes available |
PPT FP110 Fully Sintered Ferrite Powder Fully sintered NiZn ferrite, MnZn ferrite, and MgZn ferrite powders are available. Spherical or irregular particle shapes in custom particle sizes are available, ranging from sub-micron to a few hu.. |
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Particle Size | 50 - 200 µm | 50 - 200 µm | spherical sizes available |
PPT FP160 Fully Sintered Ferrite Powder Fully sintered NiZn ferrite, MnZn ferrite, and MgZn ferrite powders are available. Spherical or irregular particle shapes in custom particle sizes are available, ranging from sub-micron to a few hu.. |
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Particle Size | 50 - 200 µm | 50 - 200 µm | spherical sizes available |
PPT FP215 Fully Sintered Ferrite Powder Fully sintered NiZn ferrite, MnZn ferrite, and MgZn ferrite powders are available. Spherical or irregular particle shapes in custom particle sizes are available, ranging from sub-micron to a few hu.. |
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Particle Size | 50 - 200 µm | 50 - 200 µm | spherical sizes available |
PPT FP350 Fully Sintered Ferrite Powder Fully sintered NiZn ferrite, MnZn ferrite, and MgZn ferrite powders are available. Spherical or irregular particle shapes in custom particle sizes are available, ranging from sub-micron to a few hu.. |
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Particle Size | 50 - 200 µm | 50 - 200 µm | spherical sizes available |
PPT FP95 Fully Sintered Ferrite Powder Fully sintered NiZn ferrite, MnZn ferrite, and MgZn ferrite powders are available. Spherical or irregular particle shapes in custom particle sizes are available, ranging from sub-micron to a few hu.. |
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Particle Size | 50 - 60 µm | 50 - 60 µm | 90% |
H.C. Starck Amperit® 105.074 Agglomerated Sintered Molybdenum (Mo) |
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Particle Size | 50 - 60 µm | 50 - 60 µm | 90% |
H.C. Starck Amperit® 559.074 Agglomerated, Sintered Tungsten Carbide-Cobalt-Chromium 86-6-8 (WC-Co-Cr) |
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Particle Size | 50 - 70 µm | 50 - 70 µm | |
Lucite International Colacryl ® PD2 Acrylic Dental Resin A range of Methyl Methacrylate polymers designed for use as standard heat-curing denture base resins.Features: Fine free-flowing bead polymers containing residual peroxide initiator; Curing cycles f.. |
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Particle Size | 50 - 95 µm | 50 - 95 µm | |
Lucite International Lucite® 4F Glass Separation Resin Improper storage and transport of glass products (e.g. flat glass or fabricated items) can lead to costly damage caused by glass-to-glass abrasion and/or corrosion rendering it unsuitable for end-us.. |
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Particle Size | <= 50 µm | <= 50 µm | |
Ferro CF 7574 Glaze and Sealant Glass Glass Type: Zn-B-Si Typical Powder Form: VSD Typical Application: Pyrex Silicon Ferro's electronic and specialty glass group has produced over 3,000 formulations. Many are used as protective and .. |
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Particle Size | 50 - 60 µm | 50 - 60 µm | 90% |
H.C. Starck Amperit® 146.3 Chromium (Cr) HS Number: 81122031 |
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Particle Size | 50 µm | 50 µm | TEC QSD |
Trelleborg AEM Eccospheres® SI-310 Sodium Borosilicate Glass Microspheres Eccospheres® glass microspheres are hollow thin-walled glass microspheres composed of sodium borosilicate glass. To the naked eye they resemble a fine, white, free-flowing powder. However, magnific.. |
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Particle Size | 50 µm | 50 µm | TEC QSD |
Trelleborg AEM Eccospheres® SID-350Z Sodium Borosilicate Glass Microspheres Eccospheres® glass microspheres are hollow thin-walled glass microspheres composed of sodium borosilicate glass. To the naked eye they resemble a fine, white, free-flowing powder. However, magnific.. |
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Particle Size | <= 50 µm | <= 50 µm | |
Epoxy Technology EPO-TEK® 430 Epoxy Product Description: A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding .. |
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Particle Size | <= 50 µm | <= 50 µm | |
Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding... |
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Particle Size | <= 50 µm | <= 50 µm | |
Epoxy Technology EPO-TEK® H44 Gold-Filled, Electrically Conductive Epoxy Product Description: EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.Advantages & Application Notes: High visco.. |
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Particle Size | <= 50 µm | <= 50 µm | |
Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.Advantages & Application N.. |
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Particle Size | 50 µm | 50 µm | Average D50; Laser Diffraction |
ALM PA 850-Nat Nylon 11 SLS Prototyping Polymer Unfilled PA 11 formulated for easy processing. Can be run as a drop-in replacement for other commercially available PA 11 laser sintering powders. Parts produced from PA 850 exhibit outstanding mech.. |
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Particle Size | <= 50 µm | <= 50 µm | uncured |
Atom Adhesives AA-BOND G298 Epoxy Adhesive AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro.. |