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Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy

Category Polymer , Thermoset , Epoxy
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.Advantages & Application Notes: A pot life of at least one day is mass production friendly and convenient for consecutive manufacturing shifts.Its thixotropic nature allows for dispensing “domes or hemispheres” directly over the IC without the need for using a dam or cavity to control flow.Suggested Applications:Semiconductor:Glob top encapsulant for COB die attach.Plastic semiconductor package filling instead of traditional epoxy transfer molding compound.Electronic/PCB: general protection of SMDs.Opto-electronics: black and opaque epoxy for adhesive and sealing applications while blocking IR and VIS light.In some cases, it is advantageous to pre-warm the epoxy < 50°C in order to decrease its thixotropic nature, while increasing capillary and flow rate.Low CTE makes it ideal for keeping stresses to a minimum.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.31 g/cc
1.31 g/cc
Part A
1.34 g/cc
1.34 g/cc
Part B
Particle Size <= 50 µm
<= 50 µm
Viscosity 5000 - 7000 cP

@Temperature 23.0 °C
5000 - 7000 cP

@Temperature 73.4 °F
50 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 86
86
Tensile Modulus 4.13 GPa
599 ksi
Storage
Shear Strength 13.8 MPa
2000 psi
Lap
>= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 30.0 µm/m-°C
16.7 µin/in-°F
Below Tg
76.0 µm/m-°C
42.2 µin/in-°F
Above Tg
Thermal Conductivity 0.430 W/m-K
2.98 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 250 °C
482 °F
Continuous
350 °C
662 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 90.0 °C
>= 194 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 438 °C
820 °F
Degradation Temperature
Optical Properties Metric English Comments
Transmission, Visible <= 0.010 %

@Wavelength 400 nm
<= 0.010 %

@Wavelength 400 nm
<= 1.0 %

@Wavelength 900 nm
<= 1.0 %

@Wavelength 900 nm
<= 5.0 %

@Wavelength 2000 nm
<= 5.0 %

@Wavelength 2000 nm
Electrical Properties Metric English Comments
Volume Resistivity >= 3.00e+12 ohm-cm
>= 3.00e+12 ohm-cm
Dielectric Constant 3.39

@Frequency 1000 Hz
3.39

@Frequency 1000 Hz
Dissipation Factor 0.0060

@Frequency 1000 Hz
0.0060

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 150 °C
0.500 hour

@Temperature 302 °F
Minimum Bond Line
60.0 min

@Temperature 125 °C
1.00 hour

@Temperature 257 °F
Minimum Bond Line
Pot Life 1440 min
1440 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Black
Part A
Tan
Part B
Consistency Smooth paste
Mix Ratio By Weight 10:1
Number of Components Two
Thixotropic Index 2.5
Weight Loss 0.19%
200°C
0.34%
250°C
0.48%
300°C
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