Polymer Property : Density = 0.0704 lb/in³ Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Density	1.95 g/cc	0.0704 lb/in³
3M Dyneon™ THV™ 200G Fluorothermoplastic, Pellet Form (discontinued **) Data provided by the manufacturer, Dyneon LLC.This unique, melt-processable, tetrafluoroethylene, hexafluoropropylene, and vinylidene fluoride (THV) terpolymer provides a unique combination of perf..
Density	1.95 g/cc	0.0704 lb/in³	ASTM D792
Solvay Specialty Polymers Ryton® R-7-120BL Polyphenylene Sulfide Compound (Unverified Data**) Black Polyphenylene Sulfide CompoundRyton® R-7-120BL is an advanced glass/mineral filled polyphenylene sulfide compound developed to provide good weldline strength and low maintenance molding using..
Density	1.95 g/cc	0.0704 lb/inÂ³	EN 60893
HOS-Technik Homide 250 Bismaleimide Resin Homide 250 is a prepolymer bismaleimide resin system with a low softening range of 90-125Â°C supplied in powder form. The resin can be cured thermally to create a cross-linked thermoset with excel..
Density	1.95 g/cc	0.0704 lb/inÂ³	ASTM D792
Manifattura Cattaneo RULONÂ® J Polytetrafluoroethylene Manifattura Cattaneo products are available in semi-finished forms such as bars, profiles, sheets and plates.Information provided by Manifattura Cattaneo s.p.a.
Density	1.95 g/cc	0.0704 lb/inÂ³	Apparent
Gouda Vuurvast C Dense Refractory Brick Description: A dry-pressed fireclay brick for use up to 1250Â°C with a good resistance to acid slags and vapors. Application: industrial furnaces, chimneys, electrolytic reduction cells.Remarks: T..
Density	1.95 g/cc	0.0704 lb/inÂ³	typical
Momentive Performance Materials HBC Hot-Pressed Boron Nitride Hot-pressed BN is compacted at temperatures up to 2000Â°C and pressures up to 2000 psi to form a dense, strong engineering material that is easily machined. It is available in standard and custom..
Density	1.95 g/cc	0.0704 lb/inÂ³	ASTM D572
Haysite 20000 Polyester BMC, 15% Glass Reinforced The 20000 series bulk molding compound is an electrical grade that can be compression, transfer, or injection molded. Offering good arc/track properties and mechanical strength, this grade is also r..
Density	1.95 g/cc	0.0704 lb/inÂ³	ISO 1183
Menzolit MenzolitÂ® BMC 2910 Unsaturated Polyester UP BMC 2910 incorporates additives which enhance the integral performance of mouldings during and after fire, currently used to mould Boltcaps which are designed to provide protection to the bolted co..
Density	1.95 g/cc	0.0704 lb/inÂ³	ISO R 1183
Multibase MultibatchÂ® ME 50062 Anti-blocking Masterbatch LDPE. 80% CaCO3FilledVery Highly FilledInformation provided by Multibase
Density	1.95 g/cc	0.0704 lb/inÂ³	ASTM D792
Saint-Gobain FluoroloyÂ® A12 High Performance Seal Material Excellent wear and heat resistance; Non-abrasive; Recommended for moderate to high speed service running against soft or hard metals; Performs well against lubricated and non-lubricated surfacesInfo..
Density	1.95 g/cc	0.0704 lb/inÂ³
Saint-Gobain RulonÂ® 954 Bearing/Seal PTFE A conductive PTFE material that is available in tape, sheet (extruded) and rod (extruded).Information provided by distributor TriStar Plastics Corp.
Density	1.95 g/cc	0.0704 lb/inÂ³	ASTM D792
SABIC Innovative Plastics LNP THERMOCOMP ZX06323 PPE+HIPS (Asia Pacific) This material is mineral filled PPO grade with high dielectric constant and low loss tangent
Density	1.95 g/cc	0.0704 lb/inÂ³	ASTM D792
Sumitomo Bakelite North America 1907-1 / 1907B-1 Glass Reinforced Hardware Grade Epoxy Epoxy is the premier material for military firewall connectors.Information provided by Sumitomo Bak North America, Inc.
Density	1.95 g/cc	0.0704 lb/inÂ³	ASTM D792
Sumitomo Bakelite North America FS-10-VO-P Short-Glass Reinforced Diallyl Phthalate Isophthalate DAP Resin Isomer. Used for critical, high-performance military and commercial electrical components where long-term reliability is demanded.Meets the requirements of ASTM D5948 Type SI..
Density	1.95 g/cc	0.0704 lb/inÂ³	Relative Density; ASTM D792
Sumitomo Bakelite North America SI 9045C Silicone Compound Long fiberglass and graphite filled silicone molding compound which offers moderate strength properties, high impact resistance, and excellent thermal stability at elevated temperatures.Information ..
Density	1.95 - 2.06 g/cc	0.0704 - 0.0744 lb/in³	ASTM D792
Zeus THV Tubing THV Tubing is a Terpolymer of Tetrafluoroethylene, Hexafluoropropylene and Vinylidene fluoride. THV is the most flexible fluoropolymer available and has the highest degree of optical clarity.
Density	1.95 g/cc	0.0704 lb/in³
Magnesium Elektron Elektron® 675 Magnesium Wrought Alloy High strength wrought Mg alloy used for high performance components, including at elevated temperature. Excellent corrosion resistance and easily machined. Can be extruded, forged and hot formed. ..
Density	1.95 g/cc	0.0704 lb/in³
Cosmic Plastics E484 Glass Filled Epoxy Molding Compound, Electrical Grade Data provided by the manufacturer.
Density	1.95 g/cc	0.0704 lb/in³
Cosmic Plastics E4905 Mineral Filled Epoxy Molding Compound, Encapsulated Grade Data provided by the manufacturer.
Density	1.95 g/cc	0.0704 lb/in³	DIN 53479
Polyram RamLloy PI300G6 PVDF, 30% Glass Fiber 30% glass fiber reinforced, high thermal resistance high UV and radiation PVDF for injection molding applicationsInformation provided by Polyram Ram On Ind.
Density	1.95 g/cc	0.0704 lb/in³	24hr/23°C/50% RH; ISO 1183-A; IEC/EN 60893-2 8.1
Elektro-Isola G-Etronax PI Polyimide, Glass Fabric Reinforcement, Dark Brown, Sheets Description: The most temperature-resistant material of all types. Retains its outstanding mechanical properties even at very high application temperatures. Applications: Used as thermal insulation ..
Density	1.95 - 2.15 g/cc	0.0704 - 0.0777 lb/in³
Aremco Ceramabond™ 865 High Temperature Ceramic Adhesive/Paste, Aluminum Nitride Filled Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and..
Density	1.95 - 2.22 g/cc	0.0704 - 0.0802 lb/in³
Momentive Performance Materials Pyrolytic Boron Nitride (PBN) Coating High temperature protective coating for graphite.PBN has become the material of choice for compound semiconductor crystal growth and wafer processing. PBN coatings also seal and protect graphite fr..