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HOS-Technik Homide 250 Bismaleimide Resin

Category Polymer , Thermoset , Polyimide, TS
Manufacturer HOS-Technik GmbH
Trade Name Homide
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF HOS-Technik Homide 250 Bismaleimide Resin.pdf
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Material Notes:
Homide 250 is a prepolymer bismaleimide resin system with a low softening range of 90-125°C supplied in powder form. The resin can be cured thermally to create a cross-linked thermoset with excellent thermal and mechanical resistance. Homide 250 can be processed in powder form or dissolved in an organic solvent, such as dimethylformamide or N-methylpyrrolidone, up to a concentration of 45% for the production of composite materials.
Physical Properties Metric English Comments
Density 1.95 g/cc
0.0704 lb/in³
EN 60893
Water Absorption 0.10 %
0.10 %
EN 60893
Mechanical Properties Metric English Comments
Tensile Strength 300 MPa

@Thickness >=1.60 mm
 43500 psi

@Thickness >=0.0630 in
 EN 60893
Modulus of Elasticity 25.0 GPa

@Thickness >=1.60 mm
 3630 ksi

@Thickness >=0.0630 in
 EN 60893
Flexural Strength 360 MPa

@Thickness >=1.60 mm,
Temperature 200 °C
 52200 psi

@Thickness >=0.0630 in,
Temperature 392 °F
 Perpendicular to laminations; EN 60893
425 MPa

@Thickness >=1.60 mm,
Temperature 150 °C
 61600 psi

@Thickness >=0.0630 in,
Temperature 302 °F
 Perpendicular to laminations; EN 60893
475 MPa

@Thickness >=1.60 mm,
Temperature 100 °C
 68900 psi

@Thickness >=0.0630 in,
Temperature 212 °F
 Perpendicular to laminations; EN 60893
500 MPa

@Thickness >=1.60 mm,
Temperature 50.0 °C
 72500 psi

@Thickness >=0.0630 in,
Temperature 122 °F
 Perpendicular to laminations; EN 60893
500 MPa

@Thickness >=1.60 mm,
Temperature 20.0 °C
 72500 psi

@Thickness >=0.0630 in,
Temperature 68.0 °F
 Perpendicular to laminations; EN 60893
Compressive Strength 440 MPa

@Thickness >=5.00 mm,
Temperature 200 °C
 63800 psi

@Thickness >=0.197 in,
Temperature 392 °F
 Perpendicular to laminations; EN 60893
480 MPa

@Thickness >=5.00 mm,
Temperature 150 °C
 69600 psi

@Thickness >=0.197 in,
Temperature 302 °F
 Perpendicular to laminations; EN 60893
550 MPa

@Thickness >=5.00 mm,
Temperature 100 °C
 79800 psi

@Thickness >=0.197 in,
Temperature 212 °F
 Perpendicular to laminations; EN 60893
620 MPa

@Thickness >=5.00 mm,
Temperature 50.0 °C
 89900 psi

@Thickness >=0.197 in,
Temperature 122 °F
 Perpendicular to laminations; EN 60893
650 MPa

@Thickness >=5.00 mm,
Temperature 20.0 °C
 94300 psi

@Thickness >=0.197 in,
Temperature 68.0 °F
 Perpendicular to laminations; EN 60893
Shear Strength 70.0 MPa

@Thickness >=5.00 mm
 10200 psi

@Thickness >=0.197 in
 Parallel to laminations; EN 60893
Izod Impact Resistance 5.50 J/cm²

@Thickness >=127 mm
 26.2 ft-lb/in²

@Thickness >=5.00 in
 Parallel to laminations; EN 60893
Thermal Properties Metric English Comments
Flammability, UL94 V-0

@Thickness 3.00 mm
 V-0

@Thickness 0.118 in
 EN 60893
Electrical Properties Metric English Comments
Insulation Resistance 1.00e+6 ohm
1.00e+6 ohm
After immersion in water; EN 60893
Dielectric Constant 4.0

@Thickness >=3.00 mm,
Frequency 50.0 Hz
 4.0

@Thickness >=0.118 in,
Frequency 50.0 Hz
 EN 60893
Dielectric Strength 20.0 kV/mm

@Thickness >=3.00 mm,
Temperature 90.0 °C
 508 kV/in

@Thickness >=0.118 in,
Temperature 194 °F
 Tested in oil. Perpendicular to laminations.; EN 60893
Dissipation Factor 0.010

@Thickness >=3.00 mm,
Frequency 50.0 Hz
 0.010

@Thickness >=0.118 in,
Frequency 50.0 Hz
 EN 60893
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