Category | Polymer , Thermoplastic , Polyketone , Polyetherketoneetherketoneketone (PEKEKK), Glass Fiber Filled |
Manufacturer | Victrex |
Trade Name | ST™ |
Port | Shanghai port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Victrex® ST™ ST45GL30 Polyetherketoneetherketoneketone (PEKEKK), 30% Glass Fiber Reinforced.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 1.53 g/cc | 0.0553 lb/in³ | Crystalline; ISO 1183 |
Water Absorption at Saturation | 0.60 % @Temperature 100 °C |
0.60 % @Temperature 212 °F |
immersion; ISO 62-1 |
Viscosity | 600000 cP @Temperature 420 °C |
600000 cP @Temperature 788 °F |
melt; ISO 11443 |
Linear Mold Shrinkage, Flow | 0.0030 cm/cm | 0.0030 in/in | 360°C nozzle, 160°C tool; ISO 294-4 |
Linear Mold Shrinkage, Transverse | 0.0090 cm/cm | 0.0090 in/in | 410°C nozzle, 210°C tool; ISO 294-4 |
Spiral Flow | 10.0 cm @Thickness 1.00 mm |
3.94 in @Thickness 0.0394 in |
410°C nozzle, 210°C tool |
44.0 cm @Thickness 3.00 mm |
17.3 in @Thickness 0.118 in |
410°C nozzle, 210°C tool |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Strength at Break | 50.0 MPa @Temperature 275 °C |
7250 psi @Temperature 527 °F |
ISO 527 |
80.0 MPa @Temperature 175 °C |
11600 psi @Temperature 347 °F |
ISO 527 | |
130 MPa @Temperature 125 °C |
18900 psi @Temperature 257 °F |
ISO 527 | |
195 MPa @Temperature 23.0 °C |
28300 psi @Temperature 73.4 °F |
ISO 527 | |
Elongation at Break | 2.8 % @Temperature 23.0 °C |
2.8 % @Temperature 73.4 °F |
ISO 527 |
Tensile Modulus | 12.0 GPa @Temperature 23.0 °C |
1740 ksi @Temperature 73.4 °F |
ISO 527 |
Flexural Strength | 70.0 MPa @Temperature 275 °C |
10200 psi @Temperature 527 °F |
ISO 178 |
120 MPa @Temperature 175 °C |
17400 psi @Temperature 347 °F |
ISO 178 | |
180 MPa @Temperature 125 °C |
26100 psi @Temperature 257 °F |
ISO 178 | |
280 MPa @Temperature 23.0 °C |
40600 psi @Temperature 73.4 °F |
ISO 178 | |
Flexural Modulus | 11.0 GPa @Temperature 23.0 °C |
1600 ksi @Temperature 73.4 °F |
ISO 178 |
Compressive Strength | 50.0 MPa @Temperature 250 °C |
7250 psi @Temperature 482 °F |
ISO 604 |
75.0 MPa @Temperature 200 °C |
10900 psi @Temperature 392 °F |
ISO 604 | |
190 MPa @Temperature 120 °C |
27600 psi @Temperature 248 °F |
ISO 604 | |
290 MPa @Temperature 23.0 °C |
42100 psi @Temperature 73.4 °F |
ISO 604 | |
Izod Impact, Notched (ISO) | 11.0 kJ/m² @Temperature 23.0 °C |
5.23 ft-lb/in² @Temperature 73.4 °F |
ISO 180/A |
Izod Impact, Unnotched (ISO) | 60.0 kJ/m² @Temperature 23.0 °C |
28.6 ft-lb/in² @Temperature 73.4 °F |
ISO 180/U |
Charpy Impact Unnotched | 7.00 J/cm² @Temperature 23.0 °C |
33.3 ft-lb/in² @Temperature 73.4 °F |
ISO 179/1U |
Charpy Impact, Notched | 0.900 J/cm² @Temperature 23.0 °C |
4.28 ft-lb/in² @Temperature 73.4 °F |
ISO 179/1eA |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 40.0 µm/m-°C @Temperature <=162 °C |
22.2 µin/in-°F @Temperature <=324 °F |
Average below Tg; ISO 11359 |
100 µm/m-°C @Temperature >=162 °C |
55.6 µin/in-°F @Temperature >=324 °F |
Average above Tg; ISO 11359 | |
CTE, linear, Parallel to Flow | 21.0 µm/m-°C @Temperature <=162 °C |
11.7 µin/in-°F @Temperature <=324 °F |
Below Tg; ISO 11359 |
23.0 µm/m-°C @Temperature >=162 °C |
12.8 µin/in-°F @Temperature >=324 °F |
Above Tg; ISO 11359 | |
Thermal Conductivity | 0.350 W/m-K | 2.43 BTU-in/hr-ft²-°F | Along flow; ISO 22007-4 |
0.300 W/m-K @Temperature 23.0 °C |
2.08 BTU-in/hr-ft²-°F @Temperature 73.4 °F |
Average; ISO/CD 22007-4 | |
Melting Point | 387 °C | 729 °F | ISO 11357 |
Deflection Temperature at 1.8 MPa (264 psi) | 380 °C | 716 °F | ISO 75-f |
Glass Transition Temp, Tg | 162 °C | 324 °F | Onset; ISO 11357 |
169 °C | 336 °F | Midpoint; ISO 11357 |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Volume Resistivity | 1.00e+16 ohm-cm | 1.00e+16 ohm-cm | IEC 60093 |
Dielectric Constant | 3.3 @Frequency 1000 Hz, Temperature 23.0 °C |
3.3 @Frequency 1000 Hz, Temperature 73.4 °F |
IEC 60250 |
Dielectric Strength | 22.0 kV/mm @Thickness 2.00 mm |
559 kV/in @Thickness 0.0787 in |
IEC 60243-1 |
Dissipation Factor | 0.0040 @Frequency 1.00e+6 Hz, Temperature 23.0 °C |
0.0040 @Frequency 1.00e+6 Hz, Temperature 73.4 °F |
IEC 60250 |
Comparative Tracking Index | 150 V | 150 V | IEC 60112 |
150 V | 150 V | IEC 60112 |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Processing Temperature | <= 100 °C | <= 212 °F | Hopper Temperature |
Nozzle Temperature | 410 °C | 770 °F | |
Mold Temperature | 200 - 220 °C | 392 - 428 °F | |
Drying Temperature | 150 °C @Time 21600 sec |
302 °F @Time 6.00 hour |
|
180 °C @Time 10800 sec |
356 °F @Time 3.00 hour |