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Polymer Property : Processing Temperature = 212 °F Product List

Processing Properties

Tips: 30 items are displayed at most.
Processing Properties Metric English Comments
Processing Temperature <= 100 °C
<= 212 °F
Hopper Temperature
Victrex® PEEK 150GL30 30% Glass Fiber Reinforced
Product Description: High performance thermoplastic material, 30% glass fibre reinforced PolyEtherEtherKetone (PEEK), semi crystalline, granules for injection moulding, easy flow, FDA food contact c..
Processing Temperature <= 100 °C
<= 212 °F
Hopper Temperature
Victrex® PEEK 450CA30 30% Carbon Fiber Reinforced
General purpose, 30% carbon fiber reinforced, pelletized grade for injection molding.Information provided by Victrex.
Processing Temperature <= 100 °C
<= 212 °F
Hopper Temperature
Victrex® PEEK 90CA30 Polyetheretherketone, 30% Carbon Fibre Reinforced
Product Description:High performance thermoplastic material, 30% carbon fibre reinforced Polyetheretherketone (PEEK), semi crystalline, granules for injection moulding, very easy flow, FDA food cont..
Processing Temperature <= 100 °C
<= 212 °F
Hopper Temperature
Victrex® PEEK 90GL60 Polyetheretherketone, 60% Glass Fibre Reinforced
Product Description:High performance thermoplastic material, 60% glass fibre reinforced Polyetheretherketone (PEEK), semi crystalline, granules for injection moulding, standard flow, FDA food contac..
Processing Temperature <= 100 °C
<= 212 °F
Hopper Temperature
Victrex® WG102™ Polyaryletherketone
Product Description: High performance thermoplastic material, PolyArylEtherKetone (PAEK), semi crystalline, granules for injection moulding, standard flow, FDA food contact compliantWG102 does not c..
Processing Temperature 100 °C
212 °F
Cure time 3 hr at this temperature.
Momentive Performance Materials TSE322 Light Blue Adhesive Sealant, Non-Corrosive Flowable
One-part heat cure. Typical uses: Thermal barrier for automotive parts. Fabric seam seal.Data provided by the manufacturer, GE Silicones.GE Silicones became a part of Momentive Performance Materia..
Processing Temperature 100 °C
212 °F
Cure time 3 hr at this temperature.
Momentive Performance Materials TSE322B Black Adhesive Sealant, Non-Corrosive Flowable
One-part heat cure. Typical uses: Thermal barrier for automotive parts. Fabric seam seal.Data provided by the manufacturer, GE Silicones.GE Silicones became a part of Momentive Performance Materia..
Processing Temperature 100 °C
212 °F
Working Temperature, Prepolymer
Taiwan PU Corporation PPG CPU-1060 Polyurethane Casting Elastomer
A urethane elastomer that can be cured by reacting with a polyamine or a polyolhardener. The molding process is composed of pre-heating, degassing, maxing with a hardener, pouring into the mold, cu..
Processing Temperature 100 °C
212 °F
Working Temperature, Prepolymer
Taiwan PU Corporation PPG CPU-2079 Polyurethane Casting Elastomer
A urethane elastomer that can be cured by reacting with a polyamine or a polyolhardener. The molding process is composed of pre-heating, degassing, maxing with a hardener, pouring into the mold, cu..
Processing Temperature 100 - 120 °C
212 - 248 °F
conductor preheating temperature
Borealis Borcell™ ME1244 Medium Density Polyethylene
Borcell™ ME1244 is a fully formulated compound for chemical foamed telesingles. ME1244 is a medium-density polyethylene compound containing chemical blowing agent. Applications Borcell™ ME1244 i..
Processing Temperature <= 100 °C
<= 212 °F
Application Temp
XADC-Armoloy Diamond-Chrome Composite Coating
XADC-Armoloy® combines the Armoloy® TDC chromium coating with spherical diamond particulates. The XADC-Armoloy® coating enhances the durability of components used in a wide range of applications..
Processing Temperature 100 - 140 °C
212 - 284 °F
Lamination Adhesive
EMS-Griltech Griltex® D 1500A Copolyamide Hotmelt Adhesive (Technical Applications)
Description: GRILTEX adhesive products, either in pellet or powdered form, are used to coat apparel interlining substrates. Interlining substrates, coated with GRILTEX adhesive products, provides fo..
Processing Temperature 100 - 180 °C
212 - 356 °F
extruder
Fainplast Compounds Hax™ HFC 0108/4 Flame Retardant Polyolefin Cable Compound
Thermoplastic halogen free flame retardant compound based on polyolefins and mineral fillersGrade description:Bedding, designed to meet BS 7846Information provided by Fainplast Compounds
Processing Temperature 100 - 180 °C
212 - 356 °F
extruder
Fainplast Compounds Hax™ HF 039/4H Flame Retardant Polyolefin Cable Compound
Thermoplastic halogen free flame retardant compound based on polyolefins and mineral fillersGrade description:Sheathing, insulation, high flexibilityInformation provided by Fainplast Compounds
Processing Temperature 100 °C
212 °F
Cure 3 hrs
Aptek 2120 PMF Low modulus urethane staking compound
Premixed-frozen, low modulus urethane staking compoundAPTEK 2120-PMF is a one component, premixed-frozen, thixotropic, electrically insulating soft urethane adhesive. It was designed for the stakin..
Processing Temperature 100 °C
212 °F
Cure
Aptek 2209-A/B Clear, non-yellowing urethane adhesive
APTEK 2209-A/B is a water clear, thixotropic, two component, electrically insulating, urethane adhesive designed for bonding various substrates. APTEK 2209-A/B is effective for bonding plastics and..
Processing Temperature 100 °C
212 °F
Cure 4 hrs
Aptek 2210A/B Electrically conductive urethane adhesive
Electrically conductive urethane adhesive, silver-filled, flexible low modulus, low outgassingAPTEK 2210-A/B is a two component, silver-filled, urethane adhesive designed for application where flexi..
Processing Temperature 100 °C
212 °F
Cure 3 hrs
Aptek 2503-A/B Low modulus urethane conformal coating
APTEK 2503-A/B is an unfilled, two component, electrically insulating, transparent, flexible urethane coating system designed for the encapsulation and protection of electronic services mounted on p..
Processing Temperature 100 °C
212 °F
Cure 0.75 hrs
Aptek 6505PMF Electronic-grade, non-conductive adhesive
APTEK 6506-PMF is a one component, 100% solid, mineral-filled epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards as well as a protective barri..
Processing Temperature 100 °C
212 °F
Cure 1 hrs
Aptek 6512-PMF Electronic grade, conductive epoxy adhesive
APTEK 6512-PMF is a one component, 100% solid, silver-filled, electrically conductive epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards. APT..
Processing Temperature 100 °C
212 °F
Suggested baking time at this temperature is 0.25 hr.
Von Roll Isola IMI Varnish 704 Solventless Polyester Varnish for Electrical Insulation
Data provided by Von Roll Isola USA.IMI solventless resins provide relatively void-free insulation for greater protection against severe environments and corona breakdown. Flash Point: 42°C. Usag..
Processing Temperature 100 - 180 °C
212 - 356 °F
extruder
Fainplast Compounds Hax™ HF 045/11 Flame Retardant Polyolefin Cable Compound
Thermoplastic halogen free flame retardant compound based on polyolefins and mineral fillersGrade description:Sheathing, insulation, low shrinkageInformation provided by Fainplast Compounds
Processing Temperature <= 100 °C
<= 212 °F
Hopper Temperature
Victrex® PEEK 650G Polyetheretherketone
Product Description: High performance thermoplastic material, unreinforced PolyEtherEtherKetone (PEEK), semi crystalline, granules for injection moulding and extrusion, low viscosity, FDA food conta..
Processing Temperature <= 100 °C
<= 212 °F
Hopper Temperature
Victrex® PEEK 450CA20 Polyetheretherketone, 20% Carbon Fibre Reinforced
Product Description:High performance thermoplastic material, 20% carbon fibre reinforced Polyetheretherketone (PEEK), semi crystalline, granules for injection moulding and extrusion, standard flow, ..
Processing Temperature <= 100 °C
<= 212 °F
Hopper Temperature
Victrex® PEEK 450G903 Black Polyetheretherketone, Unreinforced
Product Description:High performance thermoplastic material, unreinforced Polyetheretherketone (PEEK), semi crystalline, granules for injection moulding and extrusion, standard flow, FDA food contac..
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