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Resinlab® EP965LVLX Clear Unfilled Electronic Grade Epoxy Encapsulant

Category Polymer , Thermoset , Epoxy , Epoxy Cure Resin , Epoxy Encapsulant, Unreinforced
Manufacturer Resinlab®
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Resinlab® EP965LVLX Clear Unfilled Electronic Grade Epoxy Encapsulant.pdf
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Material Notes:
Resinlab™ EP965LVLX Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release and a smooth high gloss surface. It has very good resistance to water, acids and bases and most organic solvents. It was especially formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP965LVLX Clear will reach full cure at room temperature within 24 hours. Cure time can be accelerated by the application of heat after product has gelled. Times and temperatures from 1 hour at 65°C to 20 minutes at 110°C are typical for small castings (less than 50 grams).Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
Physical Properties Metric English Comments
Specific Gravity 0.980 g/cc
0.980 g/cc
Part B; TM R050-16
1.05 g/cc
1.05 g/cc
Mixed; TM R050-16
1.13 g/cc
1.13 g/cc
Part A; TM R050-16
Water Absorption 0.20 %

@Time 86400 sec
0.20 %

@Time 24.0 hour
TM R050-35
Viscosity 2000 cP
2000 cP
Part B, RVT, #5, 20 rpm; TM R050-12
2500 cP
2500 cP
Mixed; TM R050-12
3000 cP
3000 cP
Part A, RVT, #5, 20 rpm; TM R050-12
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
TM R050-17
Tensile Strength at Break 27.6 MPa
4000 psi
TM R050-36
Tensile Strength, Ultimate 31.0 MPa
4500 psi
TM R050-36
Tensile Strength, Yield 13.8 MPa
2000 psi
TM R050-36
Elongation at Break 5.0 - 8.0 %
5.0 - 8.0 %
TM R050-36
Tensile Modulus 1.72 GPa
250 ksi
TM R050-36
Compressive Yield Strength 27.6 MPa
4000 psi
TM R050-38
Compressive Strength 114 MPa
16500 psi
Break; TM R050-38
114 MPa
16500 psi
Ultimate; TM R050-38
Compressive Modulus 1.59 GPa
230 ksi
TM R050-38
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Thermal Properties Metric English Comments
CTE, linear 60.0 µm/m-°C
33.3 µin/in-°F
Thermal Conductivity 0.140 W/m-K
0.972 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -40.0 °C
-40.0 °F
Glass Transition Temp, Tg 60.0 °C
140 °F
TM R050-25
Optical Properties Metric English Comments
Transmission, Visible 90 %
90 %
clear; thickness not quantified
Electrical Properties Metric English Comments
Volume Resistivity 8.00e+14 ohm-cm
8.00e+14 ohm-cm
Dielectric Constant 4.2

@Frequency 100 Hz,
Temperature 25.0 °C
4.2

@Frequency 100 Hz,
Temperature 77.0 °F
Dielectric Strength 16.1 kV/mm
410 kV/in
Processing Properties Metric English Comments
Pot Life 8.0 - 12 min
8.0 - 12 min
Mass: 50g; TM R050-19
Descriptive Properties Value Comments
Color Clear
Mix Ratio 1:1
Volume
100:85
Weight
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