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- Polymer Property : CTE, linear = 33.3 µin/in-°F
Polymer Property : CTE, linear = 33.3 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 60.0 µm/m-°C | 33.3 µin/in-°F | ASTM D-696 |
| Plaskolite Optix® CA - 75 UVA General Purpose Acrylic Resin OPTIX® general purpose acrylics are available in a variety of performance grades that offer varying melt flow rates, heat resistance, color/opacity and gloss levels.Information provided by Plaskoli.. |
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| CTE, linear | 60.0 µm/m-°C | 33.3 µin/in-°F | ASTM D-696 |
| Plaskolite West Optix® CA - 51 FDA General Purpose Acrylic Resin Generally unaffected by alkalis, hydrocarbons, non-oxidizing acids, and salt water. Transparent, translucent, opaque, and custom colors in various grades of melt flow rate and heat resistance are av.. |
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| CTE, linear | 60.0 µm/m-°C | 33.3 µin/in-°F | ASTM D-696 |
| Plaskolite West Optix® CA - 75 HID General Purpose Acrylic Resin Generally unaffected by alkalis, hydrocarbons, non-oxidizing acids, and salt water. Transparent, translucent, opaque, and custom colors in various grades of melt flow rate and heat resistance are av.. |
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| CTE, linear | 60.0 µm/m-°C | 33.3 µin/in-°F | ASTM D-696 |
| Plaskolite West Optix® CP - 71 General Purpose Acrylic Resin Generally unaffected by alkalis, hydrocarbons, non-oxidizing acids, and salt water. Transparent, translucent, opaque, and custom colors in various grades of melt flow rate and heat resistance are av.. |
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| CTE, linear | 60.0 µm/m-°C @Temperature 23.0 - 60.0 °C |
33.3 µin/in-°F @Temperature 73.4 - 140 °F |
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| Omnia Plastica PSU Polysulphone It is a non-reinforced amorphous polymer whose main features are its high thermal, electrical and mechanical properties which are typical of a crystalline polymer. Compared to its "brother" PES it h.. |
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| CTE, linear | 60.0 - 80.0 µm/m-°C | 33.3 - 44.4 µin/in-°F | Polykemi |
| Polykemi AB POLYfill PP CIP15015 Polypropylene, Mineral Reinforced Information provided by Polykemi AB |
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| CTE, linear | 60.0 - 80.0 µm/m-°C | 33.3 - 44.4 µin/in-°F | Polykemi |
| Polykemi AB POLYfill PP CIP6015F Polypropylene, Mineral Reinforced Information provided by Polykemi AB |
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| CTE, linear | 60.0 µm/m-°C | 33.3 µin/in-°F | ASTM D-696 |
| Plaskolite West Optix® CA - 42 FDA General Purpose Acrylic Resin Generally unaffected by alkalis, hydrocarbons, non-oxidizing acids, and salt water. Transparent, translucent, opaque, and custom colors in various grades of melt flow rate and heat resistance are av.. |
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| CTE, linear | 60.0 µm/m-°C | 33.3 µin/in-°F | ASTM D-696 |
| Plaskolite West Optix® CA - 42 General Purpose Acrylic Resin Generally unaffected by alkalis, hydrocarbons, non-oxidizing acids, and salt water. Transparent, translucent, opaque, and custom colors in various grades of melt flow rate and heat resistance are av.. |
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| CTE, linear | 60.0 µm/m-°C | 33.3 µin/in-°F | ASTM D-696 |
| Plaskolite West Optix® CA - 51 HF General Purpose Acrylic Resin Generally unaffected by alkalis, hydrocarbons, non-oxidizing acids, and salt water. Transparent, translucent, opaque, and custom colors in various grades of melt flow rate and heat resistance are av.. |
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| CTE, linear | 60.0 µm/m-°C | 33.3 µin/in-°F | |
| Resinlab® EP324E Clear Two Part Epoxy Casting Resin Resinlab™ EP 324E Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wettin.. |
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| CTE, linear | 60.0 µm/m-°C | 33.3 µin/in-°F | ASTM D-696 |
| Plaskolite West Optix® CP - 41 General Purpose Acrylic Resin Generally unaffected by alkalis, hydrocarbons, non-oxidizing acids, and salt water. Transparent, translucent, opaque, and custom colors in various grades of melt flow rate and heat resistance are av.. |
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| CTE, linear | 60.0 µm/m-°C | 33.3 µin/in-°F | ASTM D-696 |
| Plaskolite West Optix® CP - 86 UVA General Purpose Acrylic Resin Generally unaffected by alkalis, hydrocarbons, non-oxidizing acids, and salt water. Transparent, translucent, opaque, and custom colors in various grades of melt flow rate and heat resistance are av.. |
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| CTE, linear | 60.0 µm/m-°C @Temperature 20.0 °C |
33.3 µin/in-°F @Temperature 68.0 °F |
modified; ASTM D696 |
| Solvay Engineered Polymers INDURE™ X190 TPO
(discontinued **) Description: INDURE™ X190 engineered polyolefin material is designed for large, molded-in-color automotive exterior applications that require good scratch and mar characteristics, high stiffness, a.. |
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| CTE, linear | 60.0 µm/m-°C @Temperature 20.0 °C |
33.3 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| LATI LASULF Polysulfone (PSU)
(Unverified Data**) Description: Lasulf products are composed of polysulfone (PSU). They feature good thermal and mechanical properties such as excellent toughness, even at low temperatures, excellent dimensional stabi.. |
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| CTE, linear | 60.0 µm/m-°C @Temperature 20.0 °C |
33.3 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| LG Chemical HI855M PMMA, Impact Resistant Grade Molding granule designed for greater impact strength combined with the outstanding properties of conventional acrylic materialsFeatures: Excellent transparency and eleganceWeather resistance and che.. |
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| CTE, linear | 60.0 µm/m-°C @Temperature 20.0 °C |
33.3 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| LG Chemical IG840 PMMA, General Purpose Grade for Injection Molding General purpose grade with better flowability than IH 830 but slightly below in heat resistanceMechanical strength and surface hardnessFeatures: Excellent transparency and eleganceWeather resistance.. |
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| CTE, linear | 60.0 µm/m-°C @Temperature 20.0 °C |
33.3 µin/in-°F @Temperature 68.0 °F |
DIN 53752 |
| GEHR Plastics PA 6.6-30GF Nylon 6.6, 30% Glass Fiber, Dry Polyamide shows both a high thermostability and high stiffness, hardness and toughness. These are some of the main characteristics. Due to the fact, that the good mechanical characteristics will be .. |
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| CTE, linear | 60.0 µm/m-°C | 33.3 µin/in-°F | Alpha 1 |
| Lord Adhesives Thermosetâ„¢ MD-140 Conductive Adhesive LORD Thermosetâ„¢ MD-140 silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications such as microprocessor, po.. |
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| CTE, linear | 60.0 µm/m-°C | 33.3 µin/in-°F | Alpha 2; ASTM D3386 |
| Lord Adhesives CircuitSAFâ„¢ ME-456 Epoxy Dam Encapsulant CircuitSAFâ„¢ ME-456 is a one component, high purity, fast cure, semiconductor grade epoxy encapsulant dam material developed for use in the encapsulation of wire bonded and flip devices where a .. |
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| CTE, linear | 60.0 - 65.0 µm/m-°C | 33.3 - 36.1 µin/in-°F | |
| Master Bond EP37-3FLFAN Electrically Isolating, Flexible Epoxy Description: Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating that is formulated to cure at room temperature or more rapidl.. |
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| CTE, linear | 60.0 µm/m-°C @Temperature 20.0 °C |
33.3 µin/in-°F @Temperature 68.0 °F |
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| Tra-Con Tra-Bond 2113 Clear Low Viscosity Epoxy Adhesive TRA-BOND 2113 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flowability and wetting characteristics, and adheres strongly to gla.. |
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| CTE, linear | 60.0 µm/m-°C @Temperature 20.0 °C |
33.3 µin/in-°F @Temperature 68.0 °F |
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| Tra-Con Tra-Bond F125 Fast Gel Clear Epoxy Adhesive TRA-BOND F125 is a 10 minute gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. This clear, two part system is easily mixed and used at room te.. |
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| CTE, linear | 60.0 µm/m-°C @Temperature 20.0 °C |
33.3 µin/in-°F @Temperature 68.0 °F |
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| Trelleborg Emerson & Cuming Stycast® XT-1122 Two-Component Epoxy Flexible Encapsulant Emerson & Cuming XT-1122 Stycast® Two-Component Epoxy Flexible EncapsulantHeat, thermal shock and impact resistance. Good chemical resistance, Low Viscosity, Unfilled. Mix Ratio (by weight) = 100:6.. |
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| CTE, linear | 60.0 - 80.0 µm/m-°C @Temperature 20.0 °C |
33.3 - 44.4 µin/in-°F @Temperature 68.0 °F |
Parallel DOM |
| Alliance BIN-26 Bonded (Composite) Magnetic Material |
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| CTE, linear | 60.0 - 80.0 µm/m-°C @Temperature 20.0 °C |
33.3 - 44.4 µin/in-°F @Temperature 68.0 °F |
Parallel DOM |
| Alliance BIN-45 Bonded (Composite) Magnetic Material |
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| CTE, linear | 60.0 µm/m-°C @Temperature 20.0 °C |
33.3 µin/in-°F @Temperature 68.0 °F |
ISO 11359 |
| CENTROPLAST CENTROLYTE FG Polyethylene terephthalate, Food Grade This material is electrically insulating, with good chemical resistance, high mechanical strength and wear resistance.Information provided by CENTROPLAST Engineering Plastics GMBH |
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| CTE, linear | 60.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
33.3 µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
| CP-Polymer-Technik Wellamid® 6000 GS 25 HWCP 25% Glass Sphere Filled Nylon 6, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG |
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| CTE, linear | 60.0 - 170 µm/m-°C | 33.3 - 94.4 µin/in-°F | Average value: 104 µm/m-°C Grade Count:3 |
| Overview of materials for Nylon, Flexible Alloy This property data is a summary of similar materials in the MatWeb database for the category "Nylon, Flexible Alloy". Each property range of values reported is minimum and maximum values of appropri.. |
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| CTE, linear | 60.0 µm/m-°C | 33.3 µin/in-°F | |
| Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I.. |
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