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Resinlab® EP1385 Clear Epoxy Formulation

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Resinlab®
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Resinlab® EP1385 Clear Epoxy Formulation.pdf
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Material Notes:
Resinlab™ EP1385 Clear is an epoxy formulation designed for applications requiring resistance to E-85 type fuels. It has good wetting and adhesion to most surfaces. It has very good resistance to water, acids and bases and most organic solvents. The EP1385 Clear is a two part unfilled electronic grade epoxy encapsulating material designed for small to medium sized castings. It has a pot life of about one hour, cures quickly to a tack free handle strength at room temperature within 3 to 4 hours, and reaches a tough, semi-rigid state within 48 hours. Cure can be accelerated by the addition of heat. Times and temperatures from ½ hour at 100°C to 1 hour at 80°C or 4 hours at 50°C fill bring the product to full cure.Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
Physical Properties Metric English Comments
Specific Gravity 1.09 g/cc
1.09 g/cc
Part B; TM R050-16
1.14 g/cc
1.14 g/cc
Mixed; TM R050-16
1.16 g/cc
1.16 g/cc
Part A; TM R050-16
Water Absorption 0.35 %

@Time 86400 sec
0.35 %

@Time 24.0 hour
TM R050-35
Viscosity 1000 cP
1000 cP
Part B, RVT, #2, 2.5 rpm; TM R050-12
5000 cP
5000 cP
Mixed; TM R050-12
14000 cP
14000 cP
Part A, RVT, #5, 2.5 rpm; TM R050-12
Mechanical Properties Metric English Comments
Hardness, Shore D 75
75
TM R050-17
Tensile Strength at Break 55.2 MPa
8000 psi
TM R050-36
Tensile Strength, Ultimate 56.5 MPa
8200 psi
TM R050-36
Tensile Strength, Yield 31.0 MPa
4500 psi
TM R050-36
Elongation at Break 3.0 %
3.0 %
TM R050-36
Tensile Modulus 3.10 GPa
450 ksi
TM R050-36
Compressive Yield Strength 68.9 MPa
10000 psi
TM R050-38
Compressive Strength 138 MPa
20000 psi
Ultimate; TM R050-38
138 MPa
20000 psi
Break; TM R050-38
Compressive Modulus 2.76 GPa
400 ksi
TM R050-38
Adhesive Bond Strength 3.10 MPa
450 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Thermal Properties Metric English Comments
CTE, linear 60.0 µm/m-°C
33.3 µin/in-°F
Thermal Conductivity 0.140 W/m-K
0.972 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 150 °C
302 °F
Minimum Service Temperature, Air -40.0 °C
-40.0 °F
Glass Transition Temp, Tg 92.0 °C
198 °F
TM R050-25
Optical Properties Metric English Comments
Transmission, Visible 90 %
90 %
clear; thickness not quantified
Electrical Properties Metric English Comments
Volume Resistivity 8.00e+14 ohm-cm
8.00e+14 ohm-cm
Dielectric Constant 4.5

@Frequency 100 Hz,
Temperature 25.0 °C
4.5

@Frequency 100 Hz,
Temperature 77.0 °F
Dielectric Strength 17.3 kV/mm
440 kV/in
Processing Properties Metric English Comments
Pot Life 45 min
45 min
Mass: 100g; TM R050-19
Descriptive Properties Value Comments
Color Clear
E-85 Fuel Resistance (%) -2
Hardness change, 1 year
4.6
Weight gain, 1 year
Mix Ratio 100:47
Weight
2:1
Volume
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