Resinlab® EP1325 Thixotropic, Heat Curing Epoxy Adhesive

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Resinlab®
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Resinlab® EP1325 Thixotropic, Heat Curing Epoxy Adhesive.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where the application requires low shrinkage and excellent adhesion to a wide variety of plastics, metals and circuit board materials. These products give very good environmental protection and dielectric properties over a wide temperature range. The primary difference between the two versions is the LV version has a lower high shear viscosity (higher press flow rate) to provide easier dispensing. The amount of sag upon curing is the same.Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.

Physical Properties	Metric	English	Comments
Specific Gravity	1.30 g/cc	1.30 g/cc	TM R050-16
Water Absorption	0.17 % @Time 86400 sec	0.17 % @Time 24.0 hour	TM R050-35
Viscosity	500000 cP	500000 cP	RVT, #7, 2.5 rpm; TM R050-12

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	85	85	TM R050-17
Tensile Strength at Break	33.1 MPa	4800 psi	TM R050-36
Tensile Strength, Ultimate	33.1 MPa	4800 psi	TM R050-36
Tensile Strength, Yield	17.2 MPa	2500 psi	TM R050-36
Elongation at Break	0.00 - 1.0 %	0.00 - 1.0 %	TM R050-36
Tensile Modulus	4.83 GPa	700 ksi	TM R050-36
Compressive Yield Strength	86.2 MPa	12500 psi	TM R050-38
Compressive Strength	82.7 MPa	12000 psi	Break; TM R050-38
	103 MPa	15000 psi	Ultimate; TM R050-38
Compressive Modulus	4.14 GPa	600 ksi	TM R050-38
Adhesive Bond Strength	10.3 MPa	1500 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37

Thermal Properties	Metric	English	Comments
CTE, linear	48.0 µm/m-°C	26.7 µin/in-°F
Thermal Conductivity	0.360 W/m-K	2.50 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	150 °C	302 °F
Minimum Service Temperature, Air	-40.0 °C	-40.0 °F
Glass Transition Temp, Tg	115 °C	239 °F	TM R050-25

Electrical Properties	Metric	English
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Dielectric Constant	3.5 @Frequency 100 Hz, Temperature 25.0 °C	3.5 @Frequency 100 Hz, Temperature 77.0 °F
Dielectric Strength	17.3 kV/mm	440 kV/in

Processing Properties	Metric	English
Cure Time	5.00 - 10.0 min @Temperature 150 °C	0.0833 - 0.167 hour @Temperature 302 °F
	15.0 min @Temperature 120 °C	0.250 hour @Temperature 248 °F
	30.0 min @Temperature 110 °C	0.500 hour @Temperature 230 °F

Descriptive Properties	Value	Comments
Color	Black

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